MT18HTF6472Y-40EB2 Micron Technology Inc, MT18HTF6472Y-40EB2 Datasheet - Page 7
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MT18HTF6472Y-40EB2
Manufacturer Part Number
MT18HTF6472Y-40EB2
Description
MODULE SDRAM DDR2 512MB 240DIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT18HTF25672PY-667A1.pdf
(18 pages)
Specifications of MT18HTF6472Y-40EB2
Memory Type
DDR2 SDRAM
Memory Size
512MB
Speed
400MT/s
Package / Case
240-DIMM
Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
240RDIMM
Device Core Size
72b
Organization
64Mx72
Total Density
512MByte
Chip Density
256Mb
Access Time (max)
60ps
Maximum Clock Rate
400MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
2.25A
Number Of Elements
18
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Electrical Specifications
Table 8:
Input Capacitance
Component AC Timing and Operating Conditions
Table 9:
PDF: 09005aef80e5e752/Source: 09005aef80e5e626
HTF18C64_128_256x72.fm - Rev. E 3/07 EN
V
V
Symbol
DD
IN
I
VREF
, V
T
I
/
T
OZ
V
I
C
A
I
1
DD
OUT
Q
Absolute Maximum Ratings
Module and Component Speed Grades
Parameter
V
Voltage on any pin relative to V
Input leakage current; Any input 0V ≤ V
V
test = 0V)
Output leakage current; 0V ≤ V
ODT are disabled
V
Module ambient operating temperature
DDR2 SDRAM component case operating
temperature
REF
REF
DD
Module Speed Grade
supply voltage relative to V
Notes:
input 0V ≤ V
leakage current; V
2
Stresses greater than those listed in Table 8 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions above those indicated in the operational sections of this specifica-
tion is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
1. The refresh rate is required to double when 85°C < TC ≤ 95°C.
2. For further information, refer to technical note TN-00-08: Thermal Applications, available
Micron encourages designers to simulate the performance of the module to achieve
optimum values. Simulations are significantly more accurate and realistic than a gross
estimation of module capacitance when inductance and delay parameters associated
with trace lengths are used in simulations. JEDEC modules are currently designed using
simulations to close timing budgets.
Recommended AC operating conditions are given in the DDR2 component data sheets.
Component specifications are available on Micron’s Web site. Module speed grades
correlate with component speed grades as shown in Table 9.
-80E
-800
-667
-53E
-40E
IN
on Micron’s Web site.
≤ 0.95V; (All other pins not under
512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMM
REF
=
V
alid V
OUT
SS
SS
≤ V
REF
DD
level
IN
Q; DQs and
≤ V
DD
7
;
Commercial
Command/address,
RAS#, CAS#, WE#, S#,
CKE, ODT, BA
CK, CK#
DQ, DQS, DQS#
Industrial
Commercial
Industrial
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Component Speed Grade
Electrical Specifications
-25E
-37E
-25
-5E
-3
–250
Min
–0.5
–0.5
©2003 Micron Technology, Inc. All rights reserved.
–36
–40
–40
–5
–5
0
0
+250
Max
+2.3
+2.3
+36
+70
+85
+85
+85
+5
+5
Units
µA
µA
µA
°
°
°
°
V
V
C
C
C
C