MT18LSDT6472AG-13ED2 Micron Technology Inc, MT18LSDT6472AG-13ED2 Datasheet - Page 2
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MT18LSDT6472AG-13ED2
Manufacturer Part Number
MT18LSDT6472AG-13ED2
Description
MODULE SDRAM 512MB 168DIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT18LSDT6472AG-13ED2.pdf
(26 pages)
Specifications of MT18LSDT6472AG-13ED2
Memory Type
SDRAM
Memory Size
512MB
Speed
133MHz
Package / Case
168-DIMM
Main Category
DRAM Module
Sub-category
SDRAM
Module Type
168UDIMM
Device Core Size
72b
Organization
64Mx72
Total Density
512MByte
Chip Density
256Mb
Access Time (max)
5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Operating Current
1.233A
Number Of Elements
18
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Operating Temp Range
0C to 65C
Operating Temperature Classification
Commercial
Pin Count
168
Mounting
Socket
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Table 3:
NOTE:
09005aef807b3709
SD9_18C32_64X72AG.fm - Rev. E 11/04 EN
PART NUMBER
MT9LSDT3272(L)AG-13E_
MT9LSDT3272(L)AY-13E_
MT9LSDT3272(L)A(I)G-133_
MT9LSDT3272(L)A(I)Y-133_
MT9LSDT3272(L)AG-10E_
MT9LSDT3272(L)AY-10E_
MT18LSDT6472(L)AG-13E_
MT18LSDT6472(L)AY-13E_
MT18LSDT6472(L)A(I)G-133_
MT18LSDT6472(L)A(I)Y-133_
MT18LSDT6472(L)AG-10E_
MT18LSDT6472(L)AY-10E_
Designators for component and PCB revision are the last two characters of each part number Consult factory for current
revision codes. Example: MT9LSDT3272AG-133B1.
Part Numbers
MODULE DENSITY
256MB (x72, ECC, SR), 512MB (x72, ECC, DR)
256MB
256MB
256MB
256MB
256MB
256MB
512MB
512MB
512MB
512MB
512MB
512MB
2
CONFIGURATION
Micron Technology, Inc., reserves the right to change products or specifications without notice.
32 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
168-PIN SDRAM UDIMM
BUS SPEED
SYSTEM
133 MHz
133 MHz
133 MHz
133 MHz
100 MHz
100 MHz
133 MHz
133 MHz
133 MHz
133 MHz
100 MHz
100 MHz
©2004 Micron Technology, Inc.