MT18LSDT6472AG-13ED2 Micron Technology Inc, MT18LSDT6472AG-13ED2 Datasheet - Page 2

• Manufacturer Part Number: MT18LSDT6472AG-13ED2
• Description: MODULE SDRAM 512MB 168DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT18LSDT6472AG-13ED2

• Memory Type: SDRAM
• Memory Size: 512MB
• Speed: 133MHz
• Package / Case: 168-DIMM
• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 168UDIMM
• Device Core Size: 72b
• Organization: 64Mx72
• Total Density: 512MByte
• Chip Density: 256Mb
• Access Time (max): 5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 1.233A
• Number Of Elements: 18
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 168
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 3:
NOTE:
09005aef807b3709
SD9_18C32_64X72AG.fm - Rev. E 11/04 EN
PART NUMBER
MT9LSDT3272(L)AG-13E_
MT9LSDT3272(L)AY-13E_
MT9LSDT3272(L)A(I)G-133_
MT9LSDT3272(L)A(I)Y-133_
MT9LSDT3272(L)AG-10E_
MT9LSDT3272(L)AY-10E_
MT18LSDT6472(L)AG-13E_
MT18LSDT6472(L)AY-13E_
MT18LSDT6472(L)A(I)G-133_
MT18LSDT6472(L)A(I)Y-133_
MT18LSDT6472(L)AG-10E_
MT18LSDT6472(L)AY-10E_
Designators for component and PCB revision are the last two characters of each part number Consult factory for current
revision codes. Example: MT9LSDT3272AG-133B1.
Part Numbers
MODULE DENSITY
256MB (x72, ECC, SR), 512MB (x72, ECC, DR)
256MB
256MB
256MB
256MB
256MB
256MB
512MB
512MB
512MB
512MB
512MB
512MB
2
CONFIGURATION
Micron Technology, Inc., reserves the right to change products or specifications without notice.
32 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
168-PIN SDRAM UDIMM
BUS SPEED
SYSTEM
133 MHz
133 MHz
133 MHz
133 MHz
100 MHz
100 MHz
133 MHz
133 MHz
133 MHz
133 MHz
100 MHz
100 MHz
©2004 Micron Technology, Inc.