PCM18XK1 Microchip Technology, PCM18XK1 Datasheet - Page 468
PCM18XK1
Manufacturer Part Number
PCM18XK1
Description
MODULE PROC PIC18F8680,6680,8565
Manufacturer
Microchip Technology
Datasheet
1.PCM18XK1.pdf
(496 pages)
Specifications of PCM18XK1
Accessory Type
Processor Module
Lead Free Status / RoHS Status
Not applicable / Not applicable
For Use With/related Products
ICE2000
For Use With
ICE2000 - EMULATOR MPLAB-ICE 2000 POD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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PIC18F6585/8585/6680/8680
29.2
The following sections give the technical details of the packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS30491C-page 466
Package Details
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
CH
(F)
D1
A2
A1
E1
n1
E
D
B
n
p
A
L
c
L
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
D1
0
5
5
CH x 45
INCHES
D
NOM
A1
.020
.043
.039
.006
.024
.039
.472
.472
.394
.394
.007
.009
.035
3.5
64
16
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.045
.041
.011
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0.64
MILLIMETERS*
0
5
5
2004 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
1.00
0.18
0.22
0.89
3.5
64
16
10
10
MAX
12.25
12.25
10.10
10.10
A2
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7
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