OM11077 NXP Semiconductors, OM11077 Datasheet - Page 52

• Manufacturer Part Number: OM11077
• Description: MODULE DIMM LPC2478 ARM7
• Manufacturer: NXP Semiconductors

Specifications of OM11077

• Accessory Type: Module Card
• For Use With/related Products: ARM-57TS-LPC2478
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4742

NXP Semiconductors
9. Thermal characteristics
Table 7.
V
LPC2478
Product data sheet
Symbol
T
DD
j(max)
= 3.0 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
= −40 °C to +85 °C unless otherwise specified;
•
•
•
j
=
T
R
P
amb
D
T
th(j-a)
amb
= sum of internal and I/O power dissipation
= ambient temperature (°C),
+
= the package junction-to-ambient thermal resistance (°C/W)
(
P
D
All information provided in this document is subject to legal disclaimers.
Conditions
×
R
th j a
Rev. 2 — 29 September 2010
(
–
)
)
j
(°C), can be calculated using the following
Single-chip 16-bit/32-bit microcontroller
Min
-
DD
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
LPC2478
© NXP B.V. 2010. All rights reserved.
Unit
°C
52 of 91
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