MAX11068EVKIT+ Maxim Integrated Products, MAX11068EVKIT+ Datasheet - Page 77

• Manufacturer Part Number: MAX11068EVKIT+
• Description: KIT SMART BATT MEASUREMENT 12CH
• Manufacturer: Maxim Integrated Products

Specifications of MAX11068EVKIT+

• Main Purpose: Power Management, Battery Monitor, Car
• Utilized Ic / Part: MAX11068
• Primary Attributes: Monitors Current, Voltage, Temperature
• Secondary Attributes: 1 ~ 12 Cell- Li-Ion, 1 ~ 12 Cell- NiMH
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Embedded: -

High-voltage battery-pack systems can be subjected
to severe stresses during in-service fault conditions
and could experience similar conditions during the
manufacturing and assembly process. The MAX11068
is designed with high regard to these potential states.
Open and short circuits at the package level must
Table 39. System Fault Modes
PCB or IC package open or
short circuit—no stack load
Random connection of cells to
IC—no stack load
Random connection of
modules—no stack load
Random connect/disconnect of
communication bus—no stack
load; AC- or DC-coupled
Random connect/disconnect of
communication bus—with stack
load; AC- or DC-coupled
Connect/disconnect module
interconnect (bus bar)—no stack
load
Removal/fault of module
interconnect (bus bar)—with
stack load
Removal/fault of module
interconnect (bus bar)—with
stack under charge
CONDITION
12-Channel, High-Voltage Sensor, Smart
Failure Mode and
Effects Analysis
See pin-level failure-mode
effects analysis spreadsheet
available from the factory
No effect
No effect
Communication from host to the
first break in the daisy-chain bus
Communication from host to the
first break in the daisy-chain bus
No effect for DC- or AC-coupled
communication bus
No effect for AC-coupled
communication bus; device
damage for DC-coupled bus
No effect for AC-coupled
communication bus; device
damage for DC-coupled bus
EFFECT
Data-Acquisition Interface
be readily detected for fault diagnosis and should be
tolerated whenever possible. A number of circuits are
employed within the MAX11068 specifically to detect
such conditions and progress to a known device state.
Table 39 summarizes other conditions typical in a nor-
mal manufacturing process along with their effect on the
MAX11068 device. See
effects analysis of the MAX11068.
The built-in features of the MAX11068 should ensure low
failure-mode effects risk in most cases.
Circuit design of Figures 4 and 5 ensure protection
against random power-supply or ground connections.
Each module is referenced to its neighbor, so no special
connection order is necessary.
The level-shifted interface design of the MAX11068
ensures that the SHDN, GND
bus can be connected at any time with no load.
The level-shifted interface design of the MAX11068
ensures that the SHDN, GND
bus can be connected at any time as long as the power
bus is properly connected.
A break in the power bus does not cause a problem as
long as there is no load on the stack.
An AC-coupled bus with isolation on the SHDN pin or a
redundant bus bar connection should be used to protect
against this case.
An AC-coupled bus with isolation on the SHDN pin or a
redundant bus bar connection should be used to protect
against this case.
DESIGN RECOMMENDATION
Table 40
U
U
, ALRM
, ALRM
for the failure-mode
U
U
communication
communication
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