EVAL-AD7794EBZ Analog Devices Inc, EVAL-AD7794EBZ Datasheet - Page 36

• Manufacturer Part Number: EVAL-AD7794EBZ
• Description: BOARD EVALUATION FOR AD7794
• Manufacturer: Analog Devices Inc

Specifications of EVAL-AD7794EBZ

• Number Of Adc's: 1
• Number Of Bits: 24
• Sampling Rate (per Second): 470
• Data Interface: SPI™, QSPI™, MICROWIRE™, and DSP
• Inputs Per Adc: 6 Differential
• Input Range: ±VREF/gain
• Power (typ) @ Conditions: 2.5mW @ 470SPS
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 105°C
• Utilized Ic / Part: AD7794
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD7794/AD7795
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD7794BRU
AD7794BRU-REEL
AD7794BRUZ
AD7794BRUZ-REEL
AD7794CRUZ
AD7794CRUZ-REEL
AD7795BRUZ
AD7795BRUZ-REEL
EVAL-AD7794EB
EVAL-AD7795EB
1
©2004-2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
1
Temperature Range
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +125°C
–40°C to +125°C
–40°C to +105°C
–40°C to +105°C
0.15
0.05
D04854-0-3/07(D)
PIN 1
0.10 COPLANARITY
Figure 25. 24-Lead Thin Shrink Small Outline Package [TSSOP]
24
1
COMPLIANT TO JEDEC STANDARDS MO-153-AD
BSC
0.65
0.30
0.19
Package Description
24-Lead Thin Shrink Small Outline Package [TSSOP]
24-Lead Thin Shrink Small Outline Package [TSSOP]
24-Lead Thin Shrink Small Outline Package [TSSOP]
24-Lead Thin Shrink Small Outline Package [TSSOP]
24-Lead Thin Shrink Small Outline Package [TSSOP]
24-Lead Thin Shrink Small Outline Package [TSSOP]
24-Lead Thin Shrink Small Outline Package [TSSOP]
24-Lead Thin Shrink Small Outline Package [TSSOP]
Evaluation Board
Evaluation Board
Dimensions shown in millimeters
7.90
7.80
7.70
Rev. D | Page 36 of 36
SEATING
PLANE
(RU-24)
13
12
MAX
1.20
4.50
4.40
4.30
0.20
0.09
6.40 BSC
8°
0°
0.75
0.60
0.45
Package Option
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24