AD9785-EBZ Analog Devices Inc, AD9785-EBZ Datasheet - Page 6

• Manufacturer Part Number: AD9785-EBZ
• Description: BOARD EVAL FOR AD9785
• Manufacturer: Analog Devices Inc
• Series: TxDAC®r

Specifications of AD9785-EBZ

• Number Of Dac's: 2
• Number Of Bits: 12
• Outputs And Type: 2, Differential
• Sampling Rate (per Second): 800M
• Data Interface: Serial
• Settling Time: 22ms
• Dac Type: Current
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9785
• Silicon Manufacturer: Analog Devices
• Application Sub Type: DAC
• Kit Application Type: Data Converter
• Silicon Core Number: AD9785
• Kit Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD9785/AD9787/AD9788
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD33 to AGND, DGND, CGND
DVDD33, DVDD18, CVDD18
AGND to DGND, CGND
DGND to AGND, CGND
CGND to AGND, DGND
I120, VREF, IPTAT to AGND
OUT1_P, OUT1_N, OUT2_P, OUT2_N,
P1D[15] to P1D[0], P2D[15] to P2D[0]
DATACLK, TXENABLE to DGND
REFCLK+, REFCLK−, RESET, IRQ,
RESET, IRQ, PLL_LOCK, SYNC_O+,
Junction Temperature
Storage Temperature Range
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
to AGND, DGND, CGND
AUX1_P, AUX1_N, AUX2_P,
AUX2_N to AGND
to DGND
PLL_LOCK, SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I− to CGND
SYNC_O−, SYNC_I+, SYNC_I−,
SPI_CSB, SCLK, SPI_SDIO, SPI_SDO
to DGND
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−1.0 V to AVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
125°C
−65°C to +150°C
Rev. A | Page 6 of 64
THERMAL RESISTANCE
For this 100-lead, thermally enhanced TQFP, the exposed paddle
(EPAD) must be soldered to the ground plane. Note that these
specifications are valid with no airflow movement.
Table 5. Thermal Resistance
Resistance
θ
θ
θ
ESD CAUTION
JA
JB
JC
Unit
19.1°C/W
12.4°C/W
7.1°C/W
Conditions
EPAD soldered. No airflow.
EPAD soldered. No airflow.
EPAD soldered. No airflow.