NCP5005GEVB ON Semiconductor, NCP5005GEVB Datasheet - Page 23
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NCP5005GEVB
Manufacturer Part Number
NCP5005GEVB
Description
EVAL BOARD FOR NCP5005G
Manufacturer
ON Semiconductor
Specifications of NCP5005GEVB
Design Resources
NCP5005 EVB BOM NCP5005GEVB Gerber Files NCP5005 EVB Schematic
Outputs And Type
1, Non-Isolated
Voltage - Output
22V
Voltage - Input
3.6V
Utilized Ic / Part
NCP5005
Core Chip
NCP5005
Topology
Boost
No. Of Outputs
1
Development Tool Type
Hardware - Eval/Demo Board
Leaded Process Compatible
Yes
Mcu Supported Families
NCP5005SNT1G
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Current - Output / Channel
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
NCP5005G
Other names
NCP5005GEVBOS
PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
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damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
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0.05 (0.002)
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
S
H
1
D
5
L
A
2
*For additional information on our Pb−Free strategy and soldering
G
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
4
3
0.039
B
C
1.0
0.037
SOLDERING FOOTPRINT*
0.95
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
http://onsemi.com
CASE 483−02
0.074
SN SUFFIX
NCP5005
1.9
ISSUE C
TSOP−5
K
0.028
0.7
23
J
M
SCALE 10:1
0.094
2.4
NOTES:
inches
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. A AND B DIMENSIONS DO NOT INCLUDE
mm
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
M
A
B
C
D
G
H
J
K
L
S
0.013
MILLIMETERS
MIN
2.90
1.30
0.90
0.25
0.85
0.10
0.20
1.25
2.50
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
0
_
0.100 0.0005 0.0040
MAX
3.10 0.1142 0.1220
1.70 0.0512 0.0669
1.10 0.0354 0.0433
0.50 0.0098 0.0197
1.05 0.0335 0.0413
0.26 0.0040 0.0102
0.60 0.0079 0.0236
1.55 0.0493 0.0610
10
3.00 0.0985 0.1181
_
MIN
0
INCHES
_
MAX
10
_
NCP5005/D