PESD5V0U1UB,115 NXP Semiconductors, PESD5V0U1UB,115 Datasheet

DIODE ESD PROT UNI 5V SC-79

PESD5V0U1UB,115

Manufacturer Part Number
PESD5V0U1UB,115
Description
DIODE ESD PROT UNI 5V SC-79
Manufacturer
NXP Semiconductors
Type
TVSr
Datasheet

Specifications of PESD5V0U1UB,115

Package / Case
SC-79, SOD-523
Voltage - Reverse Standoff (typ)
5V
Voltage - Breakdown
6.8V
Polarization
Unidirectional
Mounting Type
Surface Mount
Polarity
Unidirectional
Channels
1 Channel
Operating Voltage
5 V
Breakdown Voltage
6.8 V
Termination Style
SMD/SMT
Capacitance
1.7 pF
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Dimensions
1.35 mm W x 2.7 mm L x 1.1 mm H
Capacitance Value
2.6 pF
Direction Type
Uni-Directional
Number Of Elements Per Chip
1
Esd Protection Voltage
10@HBM|9@Contact Disc KV
Maximum Leakage Current
0.1 uA
Maximum Working Voltage
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4671-2
934062186115
PESD5V0U1UB T/R
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
Ultra low capacitance unidirectional ElectroStatic Discharge (ESD) protection diodes in
small Surface-Mounted Device (SMD) plastic packages designed to protect one signal
line from the damage caused by ESD and other transients.
Table 1.
I
I
I
I
I
I
I
I
Table 2.
T
Type number
PESD5V0U1UA
PESD5V0U1UB
PESD5V0U1UL
Symbol
V
amb
RWM
PESD5V0U1UA;
PESD5V0U1UB; PESD5V0U1UL
Ultra low capacitance unidirectional ESD protection diodes
Rev. 01 — 30 October 2008
Unidirectional ESD protection of one line
Ultra low diode capacitance: C
Very low leakage current: I
USB interfaces
10/100/1000 Mbit/s Ethernet
FireWire
High-speed data lines
Subscriber Identity Module (SIM) card
protection
= 25 C unless otherwise specified.
Parameter
reverse standoff voltage
Product overview
Quick reference data
Package
NXP
SOD323
SOD523
SOD882
RM
= 1 nA
d
= 2 pF
Conditions
I
I
I
I
I
I
I
I
JEITA
SC-76
SC-79
-
ESD protection up to 9 kV
IEC 61000-4-2; level 4 (ESD)
AEC-Q101 qualified
Cellular handsets and accessories
Portable electronics
Communication systems
Computers and peripherals
Audio and video equipment
Min
-
Package configuration
very small
ultra small and flat lead
leadless ultra small
Typ
-
Product data sheet
Max
5
Unit
V

Related parts for PESD5V0U1UB,115

PESD5V0U1UB,115 Summary of contents

Page 1

PESD5V0U1UA; PESD5V0U1UB; PESD5V0U1UL Ultra low capacitance unidirectional ESD protection diodes Rev. 01 — 30 October 2008 1. Product profile 1.1 General description Ultra low capacitance unidirectional ElectroStatic Discharge (ESD) protection diodes in small Surface-Mounted Device (SMD) plastic packages designed to ...

Page 2

... NXP Semiconductors Table unless otherwise specified. amb Symbol Pinning information Table 3. Pin PESD5V0U1UA; PESD5V0U1UB 1 2 PESD5V0U1UL 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PESD5V0U1UA PESD5V0U1UB PESD5V0U1UL 4. Marking Table 5. Type number PESD5V0U1UA PESD5V0U1UB PESD5V0U1UL PESD5V0U1UA_UB_UL_1 Product data sheet ...

Page 3

... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol amb T stg Table unless otherwise specified. amb Symbol V ESD [1] Device stressed with ten non-repetitive ESD pulses. Table 8. Standard IEC 61000-4-2; level 4 (ESD) MIL-STD-883; class 3 (human body model) Fig 1 ...

Page 4

... NXP Semiconductors 6. Characteristics Table unless otherwise specified. amb Symbol V RWM dif 2 (pF) 1.9 1.8 1.7 1 MHz amb Fig 2. Diode capacitance as a function of reverse voltage; typical values PESD5V0U1UA_UB_UL_1 Product data sheet Ultra low capacitance unidirectional ESD protection diodes Characteristics Parameter Conditions ...

Page 5

... NXP Semiconductors ESD TESTER IEC 61000-4-2 network C = 150 pF 330 Z Z GND unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) GND unclamped 8 kV ESD pulse waveform (IEC 61000-4-2 network) Fig 4. ESD clamping test setup and waveforms PESD5V0U1UA_UB_UL_1 Product data sheet Ultra low capacitance unidirectional ESD protection diodes ...

Page 6

... NXP Semiconductors 7. Application information The PESD5V0U1Ux series is designed for the protection of one unidirectional data or signal line from the damage caused by ESD. The devices may be used on lines where the signal polarities are either positive or negative with respect to ground. Fig 5. Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD and Electrical Fast Transient (EFT) ...

Page 7

... NXP Semiconductors 9. Package outline 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 6. Package outline PESD5V0U1UA (SOD323/SC-76) Fig 8. Package outline PESD5V0U1UL (SOD882) 10. Packing information Table 10. The indicated -xxx are the last three digits of the 12NC ordering code. Type number ...

Page 8

... NXP Semiconductors 11. Soldering 1.65 Fig 9. 2.75 Fig 10. Wave soldering footprint PESD5V0U1UA (SOD323/SC-76) PESD5V0U1UA_UB_UL_1 Product data sheet Ultra low capacitance unidirectional ESD protection diodes 3.05 2.1 0.95 2 Reflow soldering footprint PESD5V0U1UA (SOD323/SC-76) 5 2 Rev. 01 — 30 October 2008 PESD5V0U1UA/UB/ Dimensions in mm ...

Page 9

... NXP Semiconductors Fig 11. Reflow soldering footprint PESD5V0U1UB (SOD523/SC-79) 0.9 Fig 12. Reflow soldering footprint PESD5V0U1UL (SOD882) PESD5V0U1UA_UB_UL_1 Product data sheet Ultra low capacitance unidirectional ESD protection diodes 2.15 1.1 1 Reflow soldering is the only recommended soldering method. 1.3 0.7 ...

Page 10

... NXP Semiconductors 12. Revision history Table 11. Revision history Document ID PESD5V0U1UA_UB_UL_1 PESD5V0U1UA_UB_UL_1 Product data sheet Ultra low capacitance unidirectional ESD protection diodes Release date Data sheet status 20081030 Product data sheet Rev. 01 — 30 October 2008 PESD5V0U1UA/UB/UL Change notice Supersedes - - © NXP B.V. 2008. All rights reserved. ...

Page 11

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 12

... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information Soldering ...

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