PESD5V0V4UF,115 NXP Semiconductors, PESD5V0V4UF,115 Datasheet

DIODE ESD PROTECT VLOW 6-XSON

PESD5V0V4UF,115

Manufacturer Part Number
PESD5V0V4UF,115
Description
DIODE ESD PROTECT VLOW 6-XSON
Manufacturer
NXP Semiconductors
Series
-r
Datasheet

Specifications of PESD5V0V4UF,115

Package / Case
6-XSON (Micropak™), SOT-886
Voltage - Reverse Standoff (typ)
5V
Voltage - Breakdown
6.4V
Power (watts)
16W
Polarization
4 Channel Array - Unidirectional
Mounting Type
Surface Mount
Polarity
Unidirectional
Channels
4 Channels
Clamping Voltage
13 V
Operating Voltage
5 V
Breakdown Voltage
6.8 V
Peak Surge Current
1.5 A
Peak Pulse Power Dissipation
16 W
Capacitance
12 pF
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 65 C
Dimensions
1.05(Max) mm W x 1.5(Max) mm L
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4804-2
934061202115
PESD5V0V4UF T/R
PESD5V0V4UF T/R
PESD5V0V4UF,115
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
Very low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection
diode arrays in small Surface-Mounted Device (SMD) plastic packages designed to
protect up to four signal lines from the damage caused by ESD and other transients.
Table 1.
I
I
I
I
I
I
I
Type number
PESD3V3V4UF
PESD5V0V4UF
PESD3V3V4UG
PESD5V0V4UG
PESD3V3V4UW
PESD5V0V4UW
PESDxV4UF; PESDxV4UG;
PESDxV4UW
Very low capacitance unidirectional quadruple ESD
protection diode arrays
Rev. 03 — 28 January 2008
ESD protection of up to four lines
Very low diode capacitance
Max. peak pulse power: P
Low clamping voltage: V
Computers and peripherals
Audio and video equipment
Cellular handsets and accessories
Product overview
Package
NXP
SOT886
SOT886
SOT353
SOT353
SOT665
SOT665
CL
PP
= 11 V
= 16 W
JEITA
-
-
SC-88A
SC-88A
-
-
I
I
I
I
I
I
I
Ultra low leakage current: I
ESD protection up to 12 kV
IEC 61000-4-2; level 4 (ESD)
IEC 61000-4-5 (surge); I
Communication systems
Portable electronics
Subscriber Identity Module (SIM) card
protection
JEDEC
MO-252
MO-252
-
-
-
-
Package configuration
leadless ultra small
leadless ultra small
very small
very small
ultra small and flat lead
ultra small and flat lead
Product data sheet
PP
RM
= 1.5 A
= 25 nA

Related parts for PESD5V0V4UF,115

PESD5V0V4UF,115 Summary of contents

Page 1

PESDxV4UF; PESDxV4UG; PESDxV4UW Very low capacitance unidirectional quadruple ESD protection diode arrays Rev. 03 — 28 January 2008 1. Product profile 1.1 General description Very low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) ...

Page 2

... NXP Semiconductors 1.4 Quick reference data Table unless otherwise specified. amb Symbol Per diode V RWM Pinning information Table 3. Pin PESD3V3V4UF; PESD5V0V4UF PESD3V3V4UG; PESD5V0V4UG PESD3V3V4UW; PESD5V0V4UW PESDXV4UF_G_W_3 Product data sheet Very low capacitance quadruple ESD protection diode arrays Quick reference data ...

Page 3

... NXP Semiconductors 3. Ordering information Table 4. Type number PESD3V3V4UF PESD5V0V4UF PESD3V3V4UG PESD5V0V4UG PESD3V3V4UW - PESD5V0V4UW 4. Marking Table 5. Type number PESD3V3V4UF PESD5V0V4UF PESD3V3V4UG PESD5V0V4UG PESD3V3V4UW PESD5V0V4UW [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). ...

Page 4

... NXP Semiconductors Table unless otherwise specified. amb Symbol Per diode V ESD [1] Device stressed with ten non-repetitive ESD pulses. [2] For PESDxV4UF measured from pin pin [3] For PESDxV4UG and PESDxV4UW measured from pin pin 2. Table 8. Standard Per diode IEC 61000-4-2; level 4 (ESD) MIL-STD-883 ...

Page 5

... NXP Semiconductors 6. Characteristics Table unless otherwise specified. amb Symbol Parameter Per diode V RWM PESDXV4UF_G_W_3 Product data sheet Very low capacitance quadruple ESD protection diode arrays Characteristics Conditions reverse standoff voltage PESD3V3V4UF PESD3V3V4UG PESD3V3V4UW PESD5V0V4UF PESD5V0V4UG PESD5V0V4UW reverse leakage current PESD3V3V4UF ...

Page 6

... NXP Semiconductors Table unless otherwise specified. amb Symbol Parameter dif [1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. [2] For PESDxV4UF measured from pin pin [3] For PESDxV4UG and PESDxV4UW measured from pin pin ( amb Fig 3. Peak pulse power as a function of exponential pulse duration ...

Page 7

... NXP Semiconductors (pF ( MHz amb (1) PESD3V3V4UF; PESD3V3V4UG; PESD3V3V4UW (2) PESD5V0V4UF; PESD5V0V4UG; PESD5V0V4UW Fig 5. Diode capacitance as a function of reverse voltage; typical values Fig 7. V-I characteristics for a unidirectional ESD protection diode PESDXV4UF_G_W_3 Product data sheet Very low capacitance quadruple ESD protection diode arrays 006aaa262 ...

Page 8

... NXP Semiconductors ESD TESTER IEC 61000-4-2 network C = 150 pF 330 Z Z GND unclamped +1 kV ESD voltage waveform (IEC 61000-4-2 network) GND unclamped 1 kV ESD voltage waveform (IEC 61000-4-2 network) Fig 8. ESD clamping test setup and waveforms PESDXV4UF_G_W_3 Product data sheet Very low capacitance quadruple ESD protection diode arrays ...

Page 9

... NXP Semiconductors 7. Application information The devices are designed for the protection four unidirectional data or signal lines from the damage caused by ESD and surge pulses. The devices may be used on lines where the signal polarities are both, positive and negative with respect to ground. The devices provide a surge capability per line for an 8/20 s waveform each ...

Page 10

... NXP Semiconductors 8. Package outline 1.05 0.95 0.6 0. 0.17 0.5 1 1.4 0 0.40 0.35 0.32 0.27 Dimensions in mm Fig 10. Package outline PESDxV4UF (SOT886) Fig 12. Package outline PESDxV4UW (SOT665) PESDXV4UF_G_W_3 Product data sheet Very low capacitance quadruple ESD protection diode arrays 0.50 max 0.04 max 2 ...

Page 11

... NXP Semiconductors 9. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PESD3V3V4UF SOT886 4 mm pitch tape and reel pitch tape and reel; T4 PESD5V0V4UF SOT886 4 mm pitch tape and reel pitch tape and reel ...

Page 12

... NXP Semiconductors Fig 14. Reflow soldering footprint PESDxV4UG (SOT353/SC-88A) Fig 15. Wave soldering footprint PESDxV4UG (SOT353/SC-88A) PESDXV4UF_G_W_3 Product data sheet Very low capacitance quadruple ESD protection diode arrays 2.35 0. 0.50 solder lands (4 ) solder paste solder resist occupied area Dimensions in mm 2.25 4.50 2 ...

Page 13

... NXP Semiconductors Fig 16. Reflow soldering footprint PESDxV4UW (SOT665) PESDXV4UF_G_W_3 Product data sheet Very low capacitance quadruple ESD protection diode arrays 0.70 0. 2.00 1.70 1.00 solder lands 0.075 solder resist Reflow soldering is the only recommended soldering method. Rev. 03 — 28 January 2008 PESDxV4UF/G/W 2 ...

Page 14

... PESDXV4UF_G_W_3 20080128 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type numbers PESD3V3V4UF and PESD5V0V4UF added • ...

Page 15

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 16

... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 12 Legal information ...

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