PESD5V0U1BB,115 NXP Semiconductors, PESD5V0U1BB,115 Datasheet

DIODE ULOW ESD PROTECTION SOD523

PESD5V0U1BB,115

Manufacturer Part Number
PESD5V0U1BB,115
Description
DIODE ULOW ESD PROTECTION SOD523
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PESD5V0U1BB,115

Package / Case
SC-79, SOD-523
Voltage - Reverse Standoff (typ)
5V
Voltage - Breakdown
5.5V
Polarization
Bidirectional
Mounting Type
Surface Mount
Polarity
Bidirectional
Operating Voltage
5 V
Breakdown Voltage
7 V
Termination Style
SMD/SMT
Capacitance
2.9 pF
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Dimensions
0.85 mm W x 1.65 mm L x 0.65 mm H
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4295-2
934060855115
PESD5V0U1BB T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PESD5V0U1BB,115
Manufacturer:
NXP/恩智浦
Quantity:
20 000
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diodes in
small Surface-Mounted Device (SMD) plastic packages designed to protect one data line
from the damage caused by ESD.
Table 1.
I
I
I
I
I
I
I
I
Table 2.
T
Type number
PESD5V0U1BA
PESD5V0U1BB
PESD5V0U1BL
Symbol
Per diode
V
C
amb
RWM
d
PESD5V0U1BA;
PESD5V0U1BB; PESD5V0U1BL
Ultra low capacitance bidirectional ESD protection diodes
Rev. 01 — 25 April 2007
Bidirectional ESD protection of one line
Ultra low diode capacitance: C
IEC 61000-4-2; level 4 (ESD)
Computers and peripherals
Audio and video equipment
Cellular handsets and accessories
10/100/1000 Ethernet
Local Area Network (LAN) equipment
= 25 C unless otherwise specified.
Product overview
Quick reference data
Parameter
reverse standoff voltage
diode capacitance
Package
NXP
SOD323
SOD523
SOD882
d
= 2.9 pF
Conditions
f = 1 MHz; V
I
I
I
I
I
I
I
JEITA
SC-76
SC-79
-
R
Ultra low leakage current: I
ESD protection of up to 10 kV
Communication systems
Portable electronics
Subscriber Identity Module (SIM) card
protection
FireWire
High-speed data lines
= 0 V
Min
-
-
Typ
-
2.9
Product data sheet
Package
configuration
very small
flat lead ultra small
leadless ultra small
Max
5
3.5
RM
= 5 nA
Unit
V
pF

Related parts for PESD5V0U1BB,115

PESD5V0U1BB,115 Summary of contents

Page 1

PESD5V0U1BA; PESD5V0U1BB; PESD5V0U1BL Ultra low capacitance bidirectional ESD protection diodes Rev. 01 — 25 April 2007 1. Product profile 1.1 General description Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diodes in small Surface-Mounted Device (SMD) plastic packages designed to ...

Page 2

... NXP Semiconductors 2. Pinning information Table 3. Pin SOD323; SOD523 1 2 SOD882 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number PESD5V0U1BA PESD5V0U1BB PESD5V0U1BL 4. Marking Table 5. Type number PESD5V0U1BA PESD5V0U1BB PESD5V0U1BL PESD5V0U1BA_BB_BL_1 Product data sheet Ultra low capacitance bidirectional ESD protection diodes ...

Page 3

... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device amb T stg Table 7. Symbol Per diode V ESD [1] Device stressed with ten non-repetitive ESD pulses. [2] Measured from pin 1 to pin 2. Table 8. Standard Per diode IEC 61000-4-2 ...

Page 4

... NXP Semiconductors 6. Characteristics Table unless otherwise specified. amb Symbol Per diode V RWM dif 3 (pF) 2.6 2.2 1 MHz amb Fig 2. Diode capacitance as a function of reverse voltage; typical values PESD5V0U1BA_BB_BL_1 Product data sheet Ultra low capacitance bidirectional ESD protection diodes Characteristics Parameter ...

Page 5

... NXP Semiconductors ESD TESTER IEC 61000-4-2 network C = 150 pF 330 Z Z GND unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) GND unclamped 8 kV ESD pulse waveform (IEC 61000-4-2 network) Fig 4. ESD clamping test setup and waveforms PESD5V0U1BA_BB_BL_1 Product data sheet Ultra low capacitance bidirectional ESD protection diodes ...

Page 6

... NXP Semiconductors 7. Application information The PESD5V0U1Bx series is designed for the bidirectional protection of one signal line from the damage caused by ESD pulses. The PESD5V0U1Bx series may be used on lines where the signal polarities are either positive or negative with respect to ground. Fig 5. Bidirectional protection of one line ...

Page 7

... NXP Semiconductors 8. Package outline 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 6. Package outline SOD323 (SC-76) Fig 8. Package outline SOD882 PESD5V0U1BA_BB_BL_1 Product data sheet Ultra low capacitance bidirectional ESD protection diodes 1.1 0.8 0.45 0.15 1.65 1.55 0.25 ...

Page 8

... NXP Semiconductors 9. Packing information Table 10. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PESD5V0U1BA PESD5V0U1BB PESD5V0U1BL [1] For further information and the availability of packing methods, see 10. Soldering Fig 9. Reflow soldering footprint SOD323 (SC-76) Fig 10. Wave soldering footprint SOD323 (SC-76) ...

Page 9

... NXP Semiconductors Fig 11. Reflow soldering footprint SOD523 (SC-79) Fig 12. Reflow soldering footprint SOD882 PESD5V0U1BA_BB_BL_1 Product data sheet Ultra low capacitance bidirectional ESD protection diodes 1.20 solder lands solder paste solder resist occupied area Reflow soldering is the only recommended soldering method. ...

Page 10

... NXP Semiconductors 11. Revision history Table 11. Revision history Document ID Release date PESD5V0U1BA_BB_BL_1 20070425 PESD5V0U1BA_BB_BL_1 Product data sheet PESD5V0U1BA/BB/BL Ultra low capacitance bidirectional ESD protection diodes Data sheet status Change notice Product data sheet - Rev. 01 — 25 April 2007 Supersedes - © NXP B.V. 2007. All rights reserved. ...

Page 11

... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

Page 12

... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Legal information ...

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