SM6T30CA STMicroelectronics, SM6T30CA Datasheet - Page 5

• Manufacturer Part Number: SM6T30CA
• Description: TRANSIL 600W 30V BIDIR SMB
• Manufacturer: STMicroelectronics
• Series: TRANSIL™r

Specifications of SM6T30CA

• Voltage - Reverse Standoff (typ): 25.6V
• Voltage - Breakdown: 28.5V
• Power (watts): 600W
• Polarization: Bidirectional
• Mounting Type: Surface Mount
• Package / Case: DO-214AA, SMB
• Polarity: Bidirectional
• Channels: 1 Channel
• Clamping Voltage: 53.5 V
• Operating Voltage: 25.6 V
• Breakdown Voltage: 28.5 V to 31.5 V
• Termination Style: SMD/SMT
• Peak Surge Current: 14.5 A
• Peak Pulse Power Dissipation: 600 W
• Capacitance: 1075 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Dimensions: 3.95(Max) mm W x 4.6(Max) mm L
• Number Of Elements: 1
• Package Type: SMB
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 28.5V
• Reverse Stand-off Voltage: 25.6V
• Leakage Current (max): 200nA
• Peak Pulse Current: 75A
• Test Current (it): 1mA
• Operating Temp Range: -55C to 150C
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-6492-2; SM6T30CA

SM6T
Figure 6.
Figure 8.
Figure 10. Thermal resistance junction to
1.0E+02
1.0E+01
1.0E+00
110
100
10000
1.0E-01
1.0E-02
1000
90
80
70
60
50
40
30
20
10
100
0
10
0.0
1
C (pF)
0.0
0.5
1.0
Capacitance versus reverse
applied voltage for unidirectional
types (typical values)
Peak forward voltage drop versus
peak forward current
(typical values)
ambient versus copper surface
under each lead
T
0.5
j
=125 °C
1.5
SM6T6V8A
10
1.0
2.0
V
T
SM6T15A
j
R
=25 °C
S
(V)
Cu
2.5
(cm²)
1.5
SM6T30A
(printed circuit board FR4,
copper thickness = 35 µm)
3.0
SM6T68A
100
2.0
SM6T100A
3.5
V
FM
4.0
V
SM6T220A
(V)
osc
F=1 MHz
T
2.5
=30 mV
j
=25 °C
Doc ID 3082 Rev 9
4.5
RMS
1000
3.0
5.0
Figure 7.
Figure 9.
Figure 11. Leakage current versus junction
10000
1.00
0.10
0.01
1000
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.0E-03
100
10
Zth (j-a)/Rth (j-a)
1
C (pF)
Recommended pad layout
Printed circuit board FR4, copper thickness = 35 µm
25
V
1.0E-02
V
RM
R
=V
< 10 V
RM
Capacitance versus reverse applied
voltage for bidirectional types
(typical values)
Relative variation of thermal
impedance junction to ambient
versus pulse duration
temperature (typical values)
50
1.0E-01
SM6T6V8CA
10
V
V
RM
R
75
=V
SM6T15CA
1.0E+00
10 V
RM
V
R
SM6T30CA
(V)
100
1.0E+01
SM6T68CA
100
SM6T100CA
Characteristics
1.0E+02
125
SM6T220CA
V
osc
F=1 MHz
tp
T
T (° C)
=30 mV
j
=25 °C
j
s
RMS
1.0E+03
150
1000
5/10