PESD5V0L5UY,115 NXP Semiconductors, PESD5V0L5UY,115 Datasheet
PESD5V0L5UY,115
Specifications of PESD5V0L5UY,115
934057803115
PESD5V0L5UY T/R
PESD5V0L5UY T/R
Related parts for PESD5V0L5UY,115
PESD5V0L5UY,115 Summary of contents
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PESDxL5UF; PESDxL5UV; PESDxL5UY Low capacitance unidirectional fivefold ESD protection diode arrays Rev. 02 — 8 January 2008 1. Product profile 1.1 General description Low capacitance unidirectional fivefold ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) plastic packages ...
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... NXP Semiconductors 1.4 Quick reference data Table unless otherwise specified. amb Symbol Per diode V RWM Pinning information Table 3. Pin PESD3V3L5UF; PESD5V0L5UF PESD3V3L5UV; PESD5V0L5UV PESDXL5UF_V_Y_2 Product data sheet Low capacitance unidirectional fivefold ESD protection diode arrays Quick reference data Parameter Conditions ...
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... NXP Semiconductors Table 3. Pin PESD3V3L5UY; PESD5V0L5UY Ordering information Table 4. Type number PESD3V3L5UF PESD5V0L5UF PESD3V3L5UV PESD5V0L5UV PESD3V3L5UY PESD5V0L5UY 4. Marking Table 5. Type number PESD3V3L5UF PESD5V0L5UF PESD3V3L5UV PESD5V0L5UV PESD3V3L5UY PESD5V0L5UY [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PESDXL5UF_V_Y_2 Product data sheet Low capacitance unidirectional fi ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode Per device amb T stg [1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. [2] Measured from pin pin 2. Table unless otherwise specified. ...
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... NXP Semiconductors 120 100 % (%) Fig 1. 8/20 s pulse waveform according to IEC 61000-4-5 6. Characteristics Table unless otherwise specified. amb Symbol Parameter Per diode V RWM PESDXL5UF_V_Y_2 Product data sheet Low capacitance unidirectional fivefold ESD protection diode arrays 001aaa630 Fig 2. ESD pulse waveform according to ...
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... NXP Semiconductors Table unless otherwise specified. amb Symbol Parameter dif [1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. [2] Measured from pin pin 2. PESDXL5UF_V_Y_2 Product data sheet Low capacitance unidirectional fivefold ESD protection diode arrays Characteristics …continued Conditions diode capacitance MHz ...
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... NXP Semiconductors ( amb Fig 3. Peak pulse power as a function of exponential pulse duration; typical values (pF (1) ( MHz amb (1) PESD3V3L5UF; PESD3V3L5UV; PESD3V3L5UY (2) PESD5V0L5UF; PESD5V0L5UV; PESD5V0L5UY Fig 5. Diode capacitance as a function of reverse voltage; typical values PESDXL5UF_V_Y_2 Product data sheet Low capacitance unidirectional fivefold ESD protection diode arrays ...
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... NXP Semiconductors Fig 7. V-I characteristics for a unidirectional ESD protection diode PESDXL5UF_V_Y_2 Product data sheet Low capacitance unidirectional fivefold ESD protection diode arrays RWM + P-N Rev. 02 — 8 January 2008 PESDxL5UF/V 006aaa407 © NXP B.V. 2008. All rights reserved ...
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... NXP Semiconductors ESD TESTER IEC 61000-4-2 network C = 150 pF 330 Z Z GND unclamped +1 kV ESD voltage waveform (IEC 61000-4-2 network) GND unclamped 1 kV ESD voltage waveform (IEC 61000-4-2 network) Fig 8. ESD clamping test setup and waveforms PESDXL5UF_V_Y_2 Product data sheet Low capacitance unidirectional fivefold ESD protection diode arrays ...
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... NXP Semiconductors 7. Application information The devices are designed for the protection five unidirectional data or signal lines from the damage caused by ESD and surge pulses. The devices may be used on lines where the signal polarities are both, positive and negative with respect to ground. The devices provide a surge capability per line for an 8/20 s waveform each ...
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... NXP Semiconductors 8. Package outline 1.05 0.95 0.6 0. 0.17 0.5 1 1.4 0 0.40 0.35 0.32 0.27 Dimensions in mm Fig 11. Package outline PESDxL5UF (SOT886) Fig 13. Package outline PESDxL5UY (SOT363/SC-88) PESDXL5UF_V_Y_2 Product data sheet Low capacitance unidirectional fivefold ESD protection diode arrays 0.50 max 0.04 max 1 ...
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... NXP Semiconductors 9. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PESD3V3L5UF SOT886 4 mm pitch tape and reel pitch tape and reel; T4 PESD5V0L5UF SOT886 4 mm pitch tape and reel pitch tape and reel ...
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... NXP Semiconductors Fig 15. Reflow soldering footprint PESDxL5UV (SOT666) Fig 16. Reflow soldering footprint PESDxL5UY (SOT363/SC-88) PESDXL5UF_V_Y_2 Product data sheet Low capacitance unidirectional fivefold ESD protection diode arrays 0.55 2.00 1.70 1. solder lands 0.075 solder resist Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors Dimensions in mm Fig 17. Wave soldering footprint PESDxL5UY (SOT363/SC-88) PESDXL5UF_V_Y_2 Product data sheet Low capacitance unidirectional fivefold ESD protection diode arrays 5.25 4.50 solder lands 1.15 3.75 solder resist occupied area transport direction during soldering Rev. 02 — 8 January 2008 PESDxL5UF/V/Y ...
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... Data sheet status 20080108 Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type numbers PESD3V3L5UF and PESD5V0L5UF added • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 12 Legal information ...