PIC12C508A-04I/P Microchip Technology, PIC12C508A-04I/P Datasheet - Page 100

• Manufacturer Part Number: PIC12C508A-04I/P
• Description: IC MCU OTP 512X12 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Cr

Specifications of PIC12C508A-04I/P

• Program Memory Type: OTP
• Program Memory Size: 768B (512 x 12)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC12C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 25 B
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 1
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: DVMCPA, ICE2000
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMINGDVMCPA - KIT DVR BOARD EVAL SYSTEM MXDEV1DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12C5XX
Package Type:
DS40139E-page 100
Units
Dimension Limits
PCB Row Spacing
Number of Pins
Pitch
Lower Lead Width
Upper Lead Width
Shoulder Radius
Lead Thickness
Top to Seating Plane
Top of Lead to Seating Plane
Base to Seating Plane
Tip to Seating Plane
Package Length
Molded Package Width
Radius to Radius Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
†
‡
* Controlling Parameter.
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
K04-018 8-Lead Plastic Dual In-line (P) – 300 mil
eB
E1
E
R
n
p
B
B1
R
c
A
A1
A2
L
D
E
E1
eB
‡
‡
†
2
1
c
D
MIN
0.014
0.055
0.000
0.006
0.140
0.060
0.005
0.120
0.355
0.245
0.267
0.310
5
5
A
A2
INCHES*
NOM
0.300
0.100
0.018
0.060
0.005
0.012
0.150
0.080
0.020
0.130
0.370
0.250
0.280
0.342
B1
B
10
10
8
MAX
0.022
0.065
0.010
0.015
0.160
0.100
0.035
0.140
0.385
0.260
0.292
0.380
15
15
MIN
0.36
1.40
0.00
0.20
3.56
1.52
0.13
3.05
9.02
6.22
6.78
7.87
MILLIMETERS
5
5
1999 Microchip Technology Inc.
NOM
p
7.62
2.54
0.46
1.52
0.13
0.29
3.81
2.03
0.51
3.30
9.40
6.35
7.10
8.67
A1
10
10
8
L
MAX
0.56
1.65
0.25
0.38
4.06
2.54
0.89
3.56
9.78
6.60
7.42
9.65
15
15