PIC16F1937-I/P Microchip Technology, PIC16F1937-I/P Datasheet - Page 12

IC PIC MCU FLASH 512KX14 40-PDIP

PIC16F1937-I/P

Manufacturer Part Number
PIC16F1937-I/P
Description
IC PIC MCU FLASH 512KX14 40-PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr

Specifications of PIC16F1937-I/P

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
36
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
EUSART/MI2C/SPI
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
36
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
A/d Bit Size
10 bit
A/d Channels Available
14
Height
4.95 mm
Length
53.21 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Width
14.73 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F1937-I/PT
Manufacturer:
CYPRESS
Quantity:
460
Part Number:
PIC16F1937-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16F1937-I/PT
Manufacturer:
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Quantity:
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Part Number:
PIC16F1937-I/PT
0
PIC16F193X/LF193X
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Watchdog Timer (WDT) ........................................................................................................................................................... 111
11.0 Data EEPROM and Flash Program Memory Control ............................................................................................................... 115
12.0 I/O Ports ................................................................................................................................................................................... 129
13.0 Interrupt-On-Change ................................................................................................................................................................ 149
14.0 Fixed Voltage Reference .......................................................................................................................................................... 153
15.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 155
16.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 169
17.0 Comparator Module.................................................................................................................................................................. 175
18.0 SR Latch................................................................................................................................................................................... 183
19.0 Timer0 Module ......................................................................................................................................................................... 189
20.0 Timer1 Module with Gate Control............................................................................................................................................. 193
21.0 Timer2/4/6 Modules.................................................................................................................................................................. 205
22.0 Capture/Compare/PWM Modules (ECCP1, ECCP2, ECCP3, CCP4, CCP5) .......................................................................... 209
23.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 237
24.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 289
25.0 Capacitive Sensing Module ...................................................................................................................................................... 317
26.0 Liquid Crystal Display (LCD) Driver Module ............................................................................................................................. 327
27.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 361
28.0 Instruction Set Summary .......................................................................................................................................................... 365
29.0 Electrical Specifications (PIC16F/LF1933) ............................................................................................................................... 379
30.0 Electrical Specifications (PIC16F/LF1934/36/37) ..................................................................................................................... 411
31.0 Electrical Specifications (PIC16F/LF1938/39) .......................................................................................................................... 443
32.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 475
33.0 Development Support............................................................................................................................................................... 477
34.0 Packaging Information.............................................................................................................................................................. 481
Appendix A: Data Sheet Revision History.......................................................................................................................................... 495
Appendix B: Migrating From Other PIC
Index .................................................................................................................................................................................................. 497
The Microchip Web Site ..................................................................................................................................................................... 505
Customer Change Notification Service .............................................................................................................................................. 505
Customer Support .............................................................................................................................................................................. 505
Reader Response .............................................................................................................................................................................. 506
Product Identification System............................................................................................................................................................. 507
DS41364D-page 12
Device Overview ........................................................................................................................................................................ 15
Enhanced Mid-Range CPU ........................................................................................................................................................ 23
Memory Organization ................................................................................................................................................................. 25
Device Configuration .................................................................................................................................................................. 63
Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 69
Resets ........................................................................................................................................................................................ 85
Interrupts .................................................................................................................................................................................... 93
Low Dropout (LDO) Voltage Regulator .................................................................................................................................... 107
Power-Down Mode (Sleep) ...................................................................................................................................................... 109
®
Devices.............................................................................................................................. 495
Preliminary
 2009 Microchip Technology Inc.

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