DSPIC30F1010-30I/SO Microchip Technology, DSPIC30F1010-30I/SO Datasheet - Page 45

• Manufacturer Part Number: DSPIC30F1010-30I/SO
• Description: IC DSPIC MCU/DSP 6K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F1010-30I/SO

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 6KB (2K x 24)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240002, DM300023, DM330011
• Package: 28SOIC W
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Number Of Programmable I/os: 21
• Interface Type: I2C/SPI/UART
• On-chip Adc: 6-chx10-bit
• Number Of Timers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

13.0
Table 13-1
requirements.
TABLE 13-1:
© 2010 Microchip Technology Inc.
AC/DC Characteristics
D110
D112
D113
D001
D002
D031
D041
D080
D090
D012
P1
P1A
P1B
P2
P3
P4
P4A
P5
P6
P7
P8
P9a
P9b
P10
Param.
No.
AC/DC CHARACTERISTICS
AND TIMING REQUIREMENTS
lists AC/DC characteristics and timing
V
I
I
V
V
V
V
V
V
C
T
T
T
T
T
T
T
T
T
T
T
T
T
T
PP
DDP
OL
OH
PGC
PGCL
PGCH
SET
HLD
DLY
DLY
DLY
SET
HLD
DLY
DLY
DLY
DLY
IHH
DD
DDBULK
IL
IH
IO
Sym
1
1
1
2
2
3
4
5
6
1
2
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
A
Programming Voltage on MCLR
Programming Current on MCLR
Supply Current during programming
Supply voltage
Supply voltage for Bulk Erase
programming
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O Pin (PGD)
Serial Clock (PGC) Period
Serial Clock (PGC) Low Time
Serial Clock (PGC) High Time
Input Data Setup Time to Serial Clock ↓
Input Data Hold Time from PGC ↓
Delay between 4-bit Command and
Command Operand
Delay between 4-bit Command Operand
and Next 4-bit Command
Delay between Last PGC ↓ of Command
Byte to First PGC ↑ of Read of Data
Word
V
Input Data Hold Time from MCLR ↑
Delay between Last PGC ↓ of Command
Byte to PGD ↑ by Programming
Executive
Programming Executive Command
Processing Time
Delay between PGD ↓ by Programming
Executive to PGD Released by
Programming Executive
PGC Low Time After Programming
DD
↑ Setup Time to MCLR ↑
Characteristic
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
V
0.8 V
0.8 V
DD
V
Min
100
100
500
400
3.0
3.0
40
40
15
15
40
40
20
20
10
15
—
—
—
—
—
SS
– 0.7
DD
DD
0.2 V
Max
V
V
5.5
5.5
0.6
30
30
50
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
5
DD
DD
SS
Units
mA
mA
mA
ms
ms
ms
pF
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
V
V
V
V
V
V
V
DS70284C-page 45
Row Erase
Program
memory
Bulk Erase
I
I
To meet AC
specifications
OL
OH
Conditions
= 8.5 mA
= -3.0 mA
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—