LPC2367FBD100,551 NXP Semiconductors, LPC2367FBD100,551 Datasheet - Page 39

• Manufacturer Part Number: LPC2367FBD100,551
• Description: IC ARM7 MCU FLASH 512K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2367FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 58K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 58 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4410; 935286018551; LPC2367FBD100-S

NXP Semiconductors
Table 6.
T
LPC2364_65_66_67_68_6
Product data sheet
Symbol
I
V
V
V
V
V
V
V
I
I
I
I
I
I
I
V
V
V
V
I
Oscillator pins
V
V
V
V
latch
OH
OL
OHS
OLS
pd
pu
2
LI
amb
I
O
IH
IL
hys
OH
OL
C-bus pins (P0[27] and P0[28])
IH
IL
hys
OL
i(XTAL1)
o(XTAL2)
i(RTCX1)
o(RTCX2)
=
−
40
°
Static characteristics
C to +85
Parameter
I/O latch-up current
input voltage
output voltage
HIGH-level input
voltage
LOW-level input voltage
hysteresis voltage
HIGH-level output
voltage
LOW-level output
voltage
HIGH-level output
current
LOW-level output
current
HIGH-level short-circuit
output current
LOW-level short-circuit
output current
pull-down current
pull-up current
HIGH-level input
voltage
LOW-level input voltage
hysteresis voltage
LOW-level output
voltage
input leakage current
input voltage on pin
XTAL1
output voltage on pin
XTAL2
input voltage on pin
RTCX1
output voltage on pin
RTCX2
°
C for standard devices,
…continued
Conditions
−(0.5V
(1.5V
T
pin configured to provide
a digital function
output active
I
I
V
V
V
V
V
V
V
V
I
V
V
OH
OL
OLS
j
OH
OL
OH
OL
I
I
I
DD(3V3)
I
I
< 125 °C
= 5 V
= 0 V; −40 °C to +85 °C
= 0 V; > 85 °C
= V
= 5 V
−
= −4 mA
= −4 mA
40
= 0.4 V
= V
= V
= 0 V
= 3 mA
DD(3V3)
Rev. 06 — 1 February 2010
DD(3V3)
DD(3V3)
°
DDA
C to +125
DD(3V3)
< V
);
I
) < V
< 5 V
− 0.4 V
I
°
<
C for LPC2364HBD only, unless otherwise specified.
[5][6][7]
[10]
[10]
[12]
[13]
[11]
[11]
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
[8]
[9]
[9]
[9]
[9]
[9]
Min
-
0
0
2.0
-
0.4
V
0.4
-
−4
4
-
-
10
−15
−15
0
0.7V
-
-
-
-
-
−0.5
−0.5
−0.5
−0.5
DD(3V3)
DD(3V3)
−
Typ
-
-
-
-
-
-
-
-
-
-
-
-
50
−50
−50
0
-
-
0.5V
-
2
10
1.8
1.8
1.8
1.8
[1]
DD(3V3)
© NXP B.V. 2010. All rights reserved.
Max
100
5.5
V
-
0.8
-
-
0.4
-
-
−45
50
150
−85
−100
0
-
0.3V
-
0.4
4
22
1.95
1.95
1.95
1.95
DD(3V3)
DD(3V3)
39 of 59
Unit
mA
V
V
V
V
V
V
V
mA
mA
mA
mA
μA
μA
μA
μA
V
V
V
V
μA
μA
V
V
V
V