LPC2106FBD48/01,15 NXP Semiconductors, LPC2106FBD48/01,15 Datasheet - Page 4

• Manufacturer Part Number: LPC2106FBD48/01,15
• Description: IC ARM7 MCU FLASH 128K 48-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2106FBD48/01,15

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 64 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, KSK-LPC2106-PL, DB-LQFP48-LPC2106
• Minimum Operating Temperature: - 40 C
• Cpu Family: LPC2000
• Device Core: ARM7TDMI-S
• Device Core Size: 16/32Bit
• Frequency (max): 60MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 32
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.65/3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCD568-4297 - BOARD EVAL LPC21XX MCB2100622-1019 - BOARD FOR LPC2106 48-LQFP622-1008 - BOARD FOR LPC9103 10-HVSON622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-1756 - BOARD EVAL FOR LPC210X ARM MCU
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4367; 935286617151; LPC2106FBD48/01-S

NXP Semiconductors
4. Block diagram
LPC2104_2105_2106_7
Product data sheet
Fig 1.
CAP0[2:0]
CAP1[3:0]
MAT0[2:0]
MAT1[3:0]
PWM[6:1]
EINT[2:0]
P0[31:0]
(1) Shared with GPIO.
(2) When test/debug interface is used, GPIO/other functions sharing these pins are not available.
(3) Available on LPC2104/2105/2106/01 only.
P0
Block diagram
(1)
(1)
(1)
(1)
(1)
(1)
CONTROLLER
16/32/64 kB
INTERNAL
LPC2104/2105/2106
SRAM
SRAM
32 PINS TOTAL
HIGH-SPEED
ARM7 LOCAL BUS
GPIO
REAL-TIME CLOCK
TIMER 0/TIMER 1
PURPOSE I/O
INTERRUPTS
(3)
EXTERNAL
CAPTURE/
COMPARE
GENERAL
PWM0
CONTROLLER
INTERNAL
FLASH
128 kB
FLASH
TRST
(2)
TMS
ARM7TDMI-S
TEST/DEBUG
AHB BRIDGE
Rev. 07 — 20 June 2008
INTERFACE
(2)
TCK
AHB TO APB
BRIDGE
(2)
TDI
TDO
(2)
RTCK
(2)
Advanced Peripheral
AMBA Advanced High-performance
DIVIDER
Bus (APB)
APB
Bus (AHB)
system
clock
SERIAL INTERFACE
I
LPC2104/2105/2106
2
UART0/UART1
C-BUS SERIAL
PLL
WATCHDOG
INTERFACE
SPI/SSP
CONTROL
SYSTEM
TIMER
Single-chip 32-bit microcontrollers
(3)
XTAL1
CONTROLLER
INTERRUPT
VECTORED
FUNCTIONS
DECODER
SYSTEM
XTAL2
AHB
002aaa412
RESET
© NXP B.V. 2008. All rights reserved.
V
V
V
DD(3V3)
DD(1V8)
SS
SCL
SDA
SCK
MOSI
MISO
SSEL
TXD[1:0]
RXD[1:0]
DSR1
RTS1
DCD1
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
, DTR1
, CTS1
, RI1
(1)
(1)
(1)
4 of 41
(1)
(1)
,
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