ST7FLIT19BY1B6 STMicroelectronics, ST7FLIT19BY1B6 Datasheet - Page 148

• Manufacturer Part Number: ST7FLIT19BY1B6
• Description: IC MCU 8BIT 4K FLASH 16DIP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST7FLIT19BY1B6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 7x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-DIP (0.300", 7.62mm)
• Processor Series: ST7FLIT1x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Development Tools By Supplier: ST7FLITE-SK/RAIS, ST7FLIT1B-D/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 7 Channel
• For Use With: 497-6232 - BOARD EVAL ST7LITE1B,STP5NK60Z497-5049 - KIT STARTER RAISONANCE ST7FLITE497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-5629-5

ST7LITE1xB
14.2 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK
■
■
Table 25. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
148/159
SDIP & PDIP
QFN
TQFP and SO
ECOPACK
to the JEDEC STD-020C compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
.
TM
TM
aspects
(AN2033,
transition program is available on
packages are qualified according
Sn (pure Tin)
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– TQFP, SDIP and SO Pb-packages are compati-
packages are fully compatible with Lead (Pb)
containing soldering process (see application
note AN2034)
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Pb solder paste
Yes
Yes
Yes
TM
TQFP, SDIP, SO and QFN20
Pb-free solder paste
Yes *
Yes *
Yes *