STM32F100RBH6B STMicroelectronics, STM32F100RBH6B Datasheet - Page 69

• Manufacturer Part Number: STM32F100RBH6B
• Description: MCU 32BIT ARM 128K FLASH 64LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F100RBH6B

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 24MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: STM32F100x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 24 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 6
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STM32100B-EVAL
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• On-chip Dac: 12 bit, 2 Channel
• For Use With: STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-10495

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Note:
The above formula
error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).
Table 43.
1. Guaranteed by design, not tested in production.
Table 44.
1. ADC DC accuracy values are measured after internal calibration.
2. Based on characterization, not tested in production.
Table 45.
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. Based on characterization, not tested in production.
ADC accuracy vs. negative injection current: Injecting a negative current on any of the
standard (non-robust) analog input pins should be avoided as this significantly reduces the
accuracy of the conversion being performed on another analog input. It is recommended to
1.5
7.5
13.5
28.5
41.5
55.5
71.5
239.5
Symbol
Symbol
EO
EG
EO
EG
ED
ED
ET
EL
ET
EL
T
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
s
R
(cycles)
ADC accuracy - limited test conditions
ADC accuracy
AIN
(Equation
Parameter
Parameter
max for f
1) is used to determine the maximum external impedance allowed for an
ADC
(1) (2) (3)
Doc ID 16455 Rev 6
0.125
0.625
1.125
2.375
3.45
4.625
5.96
20
= 12 MHz
f
f
V
V
T
Measurements made after
ADC calibration
f
f
V
T
Measurements made after
ADC calibration
PCLK2
ADC
PCLK2
ADC
A
A
DDA
REF+
DDA
= Full operating range
= 25 °C
= 12 MHz, R
= 12 MHz, R
(1)
= 3 V to 3.6 V
= 2.4 V to 3.6 V
t
= V
S
= 24 MHz,
= 24 MHz,
Test conditions
Test conditions
(µs)
DD
DDA
, frequency, V
AIN
AIN
(1)(2)
< 10 kΩ,
< 10 kΩ,
REF
0.4
5.9
11.4
25.2
37.2
50
NA
NA
and temperature ranges.
Electrical characteristics
±1.3
±0.5
±0.7
±0.8
±1.5
±1.5
±1.5
Typ
Typ
±1
±2
±1
R
AIN
max (kΩ)
±2.2
±1.5
±1.5
±1.5
±2.5
Max
Max
±1
±3
±2
±5
±3
Unit
LSB
Unit
LSB
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