ST72F264G2M6 STMicroelectronics, ST72F264G2M6 Datasheet - Page 160

• Manufacturer Part Number: ST72F264G2M6
• Description: IC MCU 8BIT 8K 28 SOIC
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72F264G2M6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: ST72F2x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7F264-IND/USB, ST72F34X-SK/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• Controller Family/series: ST7
• No. Of I/o's: 22
• Ram Memory Size: 256Byte
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: 497-6423 - BOARD EVAL BASED ON ST72264G1497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-2106-5

ST72260Gx, ST72262Gx, ST72264Gx
Figure 104. Low Profile Fine Pitch Ball Grid Array Package
14.2 THERMAL CHARACTERISTICS
Notes:
1. The power dissipation is obtained from the formula P
and P
2. The average chip-junction temperature can be obtained from the formula T
160/172
PORT
Symbol
T
R
Jmax
P
is the port power dissipation determined by the user.
thJA
D
SEATING
PLANE
C
Package thermal resistance (junction to ambient)
Power dissipation
Maximum junction temperature
A1 CORNER INDEX AREA
(SEE NOTE 3)
e
BOTTOM VIEW
D1
D
1)
LFBGA 6x6 (on single-layer PCB)
LFBGA 6x6 (on multilayer PCB)
Ratings
f
∅b (36 BALLS)
D
=P
2)
INT
+P
PORT
where P
SDIP32
SO28
J
= T
INT
Dim
ddd
A1 0.270
A2
D1
E1
A
D
b
E
e
f
A
is the chip internal power (I
+ P
1.210
0.450 0.500 0.550 0.018 0.020 0.022
5.750 6.000 6.150 0.226 0.236 0.242
5.750 6.000 6.150 0.226 0.236 0.242
0.720 0.800 0.880 0.028 0.031 0.035
0.850 1.000 1.150 0.033 0.039 0.045
Min
D
x RthJA.
1.120
4.000
4.000
mm
Typ Max Min
Value
150
500
60
75
56
72
1.700 0.048
0.120
0.011
inches
0.044
0.157
0.157
Typ Max
°C/W
DD
Unit
mW
°C
0.067
0.005
xV
DD
)