STM32F101RBT6 STMicroelectronics, STM32F101RBT6 Datasheet - Page 32

MCU ARM 128KB FLASH/TIMER 64LQFP

STM32F101RBT6

Manufacturer Part Number
STM32F101RBT6
Description
MCU ARM 128KB FLASH/TIMER 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F101RBT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
64
Number Of Timers
3 x 16 bit
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-6059

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Electrical characteristics
5.3
5.3.1
32/85
Table 6.
1. All main power (V
2. I
3. Negative injection disturbs the analog performance of the device. See note in
4. When several inputs are submitted to a current injection, the maximum I
Table 7.
Operating conditions
General operating conditions
Table 8.
I
Symbol
V
INJ(PIN)
I
supply, in the permitted range.
cannot be respected, the injection current must be limited externally to the I
injection is induced by V
characteristics.
positive and negative injected currents (instantaneous values). These results are based on
characterization with I
f
f
INJ(PIN)
f
PCLK1
PCLK2
V
DDA
HCLK
Symbol
V
INJ(PIN)
BAT
DD
Symbol
I
I
VDD
VSS
I
T
IO
(1)
STG
T
J
(2)(3)
must never be exceeded. This is implicitly insured if V
(2)
Current characteristics
Thermal characteristics
General operating conditions
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Backup operating voltage
Total current into V
Total current out of V
Output current sunk by any I/O and control pin
Output current source by any I/Os and control pin
Injected current on NRST pin
Injected current on High-speed external OSC_IN and Low-
speed external OSC_IN pins
Injected current on any other pin
Total injected current (sum of all I/O and control pins)
DD
, V
Storage temperature range
Maximum junction temperature
DDA
INJ(PIN)
Parameter
IN
>V
) and ground (V
DD
maximum current injection on four I/O port pins of the device.
while a negative injection is induced by V
Doc ID 13586 Rev 13
DD
SS
/V
Ratings
SS
DDA
ground lines (sink)
, V
Ratings
SSA
Must be the same potential
as V
power lines (source)
) pins must always be connected to the external power
DD
(4)
(2)
Conditions
IN
maximum is respected. If V
(1)
STM32F101x8, STM32F101xB
(1)
INJ(PIN)
IN
<V
INJ(PIN)
(4)
Section 5.3.16: 12-bit ADC
SS
–65 to +150
is the absolute sum of the
.
Min
value. A positive
2.4
1.8
Value
150
0
0
0
2
2
Max.
 25
± 25
150
150
± 5
± 5
± 5
25
IN
Max
3.6
3.6
3.6
3.6
36
36
36
maximum
Unit
MHz
Unit
Unit
°C
°C
mA
V
V
V

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