STM32F101RBT6 STMicroelectronics, STM32F101RBT6 Datasheet - Page 72

• Manufacturer Part Number: STM32F101RBT6
• Description: MCU ARM 128KB FLASH/TIMER 64LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F101RBT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 36MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: STM32F101x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 36 MHz
• Number Of Programmable I/os: 64
• Number Of Timers: 3 x 16 bit
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-6059

Package characteristics
1. Drawing is not to scale.
2. The back-side pad is not internally connected to the V
3. There is an exposed die pad on the underside of the VFQFPN package. It should be soldered to the PCB. All leads should
Table 47.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
72/85
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
Figure 39. VFQFPN36 6 x 6 mm, 0.5 mm pitch, package
Pin # 1 ID
R = 0.20
also be soldered to the PCB.
Symbol
Seating plane
D
C
e
A3
28
36
VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data
outline
27
1
0.800
0.180
5.875
1.750
5.875
1.750
0.450
0.350
Min
(1)
b
E2
E
millimeters
0.900
0.020
0.650
0.250
0.230
6.000
3.700
6.000
3.700
0.500
0.550
0.080
9
Typ
19
18
10
A1
D2
Doc ID 13586 Rev 13
A2
L
SS
A
or V
1.000
0.050
1.000
0.300
6.125
4.250
6.125
4.250
0.550
0.750
Max
DD
ddd C
power pads.
ZR_ME
Figure 40. Recommended footprint
0.0315
0.0071
0.2313
0.0689
0.2313
0.0689
0.0177
0.0138
4.30
Min
28
36
27
STM32F101x8, STM32F101xB
1
(dimensions in mm)
4.80
inches
0.0354
0.0008
0.0256
0.0098
0.0091
0.2362
0.1457
0.2362
0.1457
0.0197
0.0217
0.0031
4.10
Typ
4.80
4.30
6.30
(1)
4.10
0.30
19
9
1.00
0.0394
0.0020
0.0394
0.0118
0.2411
0.1673
0.2411
0.1673
0.0217
0.0295
18
10
Max
(1)(2)(3)
0.75
0.50
ai14870b