MCF53010CQT240 Freescale Semiconductor, MCF53010CQT240 Datasheet - Page 43

• Manufacturer Part Number: MCF53010CQT240
• Description: MCU 32BIT COLDFIRE EMAC 208LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF5301xr

Specifications of MCF53010CQT240

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 61
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: Cache
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Processor Series: MCF5301x
• Core: ColdFire V3
• Data Bus Width: 32 bit
• Data Ram Size: 128 KB
• Interface Type: UART, I2C, SPI, SSI, Ethernet
• Maximum Clock Frequency: 20 MHz to 400 MHz
• Number Of Programmable I/os: 61
• Number Of Timers: 8
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M53015EVB, M53017KIT, M53017MOD
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

5.17
Each SIM card interface consist of a total of 12 pins (two separate ports of six pins each. Mostly one port with 5 pins is used).
The interface is meant to be used with synchronous SIM cards. This means that the SIM module provides a clock for the SIM
card to use. The frequency of this clock is normally 372 times the data rate on the TX/RX pins, however SIM module can work
with CLK equal to 16 times the data rate on TX/RX pins.
There is no timing relationship between the clock and the data. The clock that the SIM module provides to the SIM card is used
by the SIM card to recover the clock from the data, like a standard UART. All six (or five when a bidirectional TXRX is used)
of the pins for each half of the SIM module are asynchronous to each other. There are no required timing relationships between
the signals in normal mode. However, there are some in reset and power down sequences.
5.17.1
Figure 30
Freescale Semiconductor
Bus Signal Line Load
Open Drain Signal Level
Bus Signal Levels
Num
10
11
12
13
14
5
6
7
8
9
shows the timing of the SIM module, and
SIM Electrical Specifications
Power Up Time
Supply Current
Pull-up Resistance
Open Drain Resistance
Output High Voltage
Output Low Voltage
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
SIM_CLK
General Timing Requirements
Parameter
Table 28. MMC/SD Interface Electrical Specifications (continued)
Preliminary—Subject to Change Without Notice
Figure 30. SIM Clock Timing Diagram
Design
Value
Sfall
NA
MCF5301x Data Sheet, Rev. 5
47
—
—
—
—
—
—
—
—
Table 29
0.625 x V
0.75 x V
V
V
DD
SS
Min
100
NA
10
—
—
—
– 0.3
lists the timing parameters.
– 0.2
DD
DD
1/Sfreq
0.125 x V
0.25 x V
V
Srise
DD
Max
250
200
100
NA
0.3
—
—
+ 3
DD
DD
kohm Internal PU
kohm For MMC cards only
Unit
Preliminary Electrical Characteristics
mA
ms
V
V
V
V
V
V
For MMC cards only
I
I
I
I
OH
OL
OH
OL
= 2 mA
= 100 µA @V
= –100 µA
= –100 µA @V
Condition/Remark
DD
DD
min
min
43