SAK-XC2267-56F66L AC Infineon Technologies, SAK-XC2267-56F66L AC Datasheet - Page 113

• Manufacturer Part Number: SAK-XC2267-56F66L AC
• Description: IC MCU 16BIT FLASH PG-LQFP-100
• Manufacturer: Infineon Technologies
• Series: XC22xxr

Specifications of SAK-XC2267-56F66L AC

• Core Processor: C166SV2
• Core Size: 16/32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
• Peripherals: DMA, I²S, POR, PWM, WDT
• Number Of I /o: 75
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x8/10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: KX226756F66L34ACXT; SAK-XC2267-56F66L34 AC; SAK-XC2267-56F66L34ACINTR; SAK-XC2267-56F66L34ACINTR; SAK-XC2267-56F66LACINTR; SP000300104

5
In addition to the electrical parameters, the following specifcations ensure proper
integration of the XC226x into the target system.
5.1
These parameters specify the packaging rather than the silicon.
Table 34
Parameter
Exposed Pad Dimension
Power Dissipation
Thermal resistance
Junction-Ambient
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
Data Sheet
exposed pad not soldered.
soldered.
to the board.
Package and Reliability
Packaging
Package Parameters (PG-LQFP-100-3)
Symbol
Ex × Ey –
P
R
DISS
ΘJA
Min.
–
–
111
Limit Values
Max.
6.2 × 6.2
1.0
49
37
22
XC2000 Family Derivatives
Package and Reliability
Unit Notes
mm –
W
K/W No thermal via
K/W 4-layer, no pad
K/W 4-layer, pad
XC2267 / XC2264
–
V2.1, 2008-08
3)
1)
2)