ADUC7128BSTZ126-RL Analog Devices Inc, ADUC7128BSTZ126-RL Datasheet - Page 91

• Manufacturer Part Number: ADUC7128BSTZ126-RL
• Description: IC DAS MCU ARM7 ADC/DDS 64-LQFP
• Manufacturer: Analog Devices Inc
• Series: MicroConverter® ADuC7xxxr

Specifications of ADUC7128BSTZ126-RL

• Core Size: 16/32-Bit
• Program Memory Size: 126KB (126K x 8)
• Core Processor: ARM7
• Speed: 41.78MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: PLA, POR, PWM, PSM, Temp Sensor, WDT
• Number Of I /o: 28
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x12b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LQFP
• Controller Family/series: (ARM7) ADUC
• No. Of I/o's: 40
• Cpu Speed: 41.78MHz
• No. Of Timers: 5
• Digital Ic Case Style: LQFP
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: EVAL-ADUC7128QSPZ - KIT DEV FOR ADUC7128
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: ADUC7128BSTZ126-RLTR

OUTLINE DIMENSIONS
1.00
0.85
0.80
SEATING
PLANE
12° MAX
PIN 1
INDICATOR
1.45
1.40
1.35
ROTATED 90° CCW
BSC SQ
9.00
VIEW
TOP
VIEW A
SEATING
PLANE
0.80 MAX
0.65 TYP
0.50 BSC
Figure 73. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
0.08
COPLANARITY
Figure 74. 64-Lead Low Profile Quad Flat Package [LQFP]
* COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
0.20
0.09
BSC SQ
3.5°
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
0°
7°
8.75
0.20 REF
0.75
0.60
0.45
0.05 MAX
0.02 NOM
9 mm × 9 mm Body, Very Thin Quad
0.60 MAX
Dimensions shown in millimeters
Dimensions shown in millimeters
0.50
0.40
0.30
Rev. 0 | Page 91 of 92
1.60
MAX
(CP-64-1)
VIEW A
(ST-64-2)
48
33
49
32
0.60 MAX
16
1
64
17
(BOTTOM VIEW)
EXPOSED PAD
LEAD PITCH
PIN 1
7.50
REF
BSC
0.50
(PINS DOWN)
TOP VIEW
12.20
12.00 SQ
11.80
0.30
0.25
0.18
17
64
16
1
THE EXPOSE PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE GROUND PLANE.
0.27
0.22
0.17
* 4.85
4.55
4.70 SQ
PIN 1
INDICATOR
49
32
48
33
ADuC7128/ADuC7129
10.20
10.00 SQ
9.80