MCF5407AI220 Freescale Semiconductor, MCF5407AI220 Datasheet - Page 6

IC MPU 32B 220MHZ COLDF 208-FQFP

MCF5407AI220

Manufacturer Part Number
MCF5407AI220
Description
IC MPU 32B 220MHZ COLDF 208-FQFP
Manufacturer
Freescale Semiconductor
Series
MCF540xr
Datasheets

Specifications of MCF5407AI220

Core Processor
Coldfire V4
Core Size
32-Bit
Speed
220MHz
Connectivity
EBI/EMI, I²C, UART/USART
Peripherals
DMA, WDT
Number Of I /o
16
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
208-FQFP
Maximum Clock Frequency
220 MHz
Operating Supply Voltage
1.8 V, 3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Program Memory Size
24KB
Cpu Speed
220MHz
Embedded Interface Type
I2C, UART
Digital Ic Case Style
FQFP
No. Of Pins
208
Supply Voltage Range
3.3V
Rohs Compliant
Yes
For Use With
M5407C3 - KIT EVAL FOR MCF5407 W/ETHERNET
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5407AI220
Manufacturer:
freescaie
Quantity:
6
Part Number:
MCF5407AI220
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
MCF5407AI220
Manufacturer:
FREESCALE
Quantity:
1 831
Part Number:
MCF5407AI220
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCF5407AI220
Manufacturer:
NXP
Quantity:
25
ColdFire Module Description
1.2.1
The MCF5407 is manufactured in a 0.22-µ CMOS process with quad-layer-metal routing technology. This
process combines the high performance and low power needed for embedded system applications. Inputs
are 3.3-V tolerant; outputs are CMOS or open-drain CMOS with outputs operating from VDD + 0.5 V to
GND - 0.5 V, with guaranteed TTL-level specifications.
1.3
The following sections provide overviews of the various modules incorporated in the MCF5407.
1.3.1
The Version 4 ColdFire core consists of two, independent and decoupled pipelines to maximize
performance—the instruction fetch pipeline (IFP) and the operand execution pipeline (OEP).
1.3.1.1
The four-stage instruction fetch pipeline (IFP) is designed to prefetch instructions for the operand execution
pipeline (OEP). Because the fetch and execution pipelines are decoupled by a ten-instruction FIFO buffer,
the fetch mechanism can prefetch instructions in advance of their use by the OEP, thereby minimizing the
6
16-bit general-purpose I/O interface
IEEE 1149.1 test (JTAG) module
System debug support
— Real-time trace for determining dynamic execution path while in emulator mode
— Background debug mode (BDM) for debug features while halted
— Real-time debug support, including 13 user-visible hardware breakpoint registers
— Supports servicing of critical, real-time interrupt requests while the BDM is in emulator mode
— Supports comprehensive emulator functions through trace and breakpoint logic
On-chip PLL
— Accepts various clock input (CLKIN) frequencies between 25 and 54 MHz
— Supports core frequencies between 100 and 162 MHz
— Supports low-power mode
Product offerings
— 316 Dhrystone MIPS at 220 MHz
— 233 Dhrystone MIPS at 162 MHz
— Implemented in 0.22 µ, quad-layer-metal process technology with 1.8-V operation (3.3-V
— 208-pin plastic QFP package
— 0 to 70° C operating temperature at 162 and 220 MHz
— -40 to 85 C operating temperature at 162 MHz
ColdFire Module Description
compliant I/O pads)
Process
ColdFire Core
Instruction Fetch Pipeline (IFP)
MCF5407 Integrated ColdFire® Microprocessor Product Brief
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA

Related parts for MCF5407AI220