DSPIC33FJ64GS606T-I/MR Microchip Technology, DSPIC33FJ64GS606T-I/MR Datasheet - Page 353

• Manufacturer Part Number: DSPIC33FJ64GS606T-I/MR
• Description: MCU/DSP 16BIT 64KB FLASH 64QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ64GS606T-I/MR

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 64-VFQFN, Exposed Pad
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
• Number Of I /o: 58
• Ram Size: 9K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Numeric And Arithmetic Format: Fixed-Point or Floating-Point
• Instruction Set Architecture: Harvard
• Device Million Instructions Per Second: 40 MIPs
• Maximum Clock Frequency: 120 MHz
• Number Of Programmable I/os: 58
• Data Ram Size: 4 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• On-chip Dac: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

27.0
This section provides an overview of dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 electri-
cal characteristics. Additional information will be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 family are
listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional
operation of the device at these or any other conditions above the parameters indicated in the operation listings of this
specification is not implied.
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on any pin that is not 5V tolerant, with respect to V
Voltage on any 5V tolerant pin with respect to V
Voltage on any 5V tolerant pin with respect to Vss, when V
Voltage on V
Maximum current out of V
Maximum current into V
Maximum output current sunk by any I/O pin
Maximum output current sourced by any I/O pin
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports
Maximum output current sunk by non-remappable PWM pins ...............................................................................16 mA
Maximum output current sourced by non-remappable PWM pins ..........................................................................16 mA
 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
2: Maximum allowable current is a function of device maximum power dissipation (see Table 27-2).
3: Exceptions are PWMxL, and PWMxH, which are able to sink/source 16 mA, and digital pins, which are able
4: See the “Pin Diagrams” section for 5V tolerant pins.
ELECTRICAL CHARACTERISTICS
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
to sink/source 8 mA.
DD
CAP
with respect to V
/V
DDCORE
DD
SS
with respect to V
pin
pin ...........................................................................................................................300 mA
(2)
...........................................................................................................................250 mA
SS
(1)
......................................................................................................... -0.3V to +4.0V
(2)
...............................................................................................................200 mA
SS
(3)
....................................................................................... 2.25V to 2.75V
........................................................................................................4 mA
SS
(3)
, when Vdd  3.0V
...................................................................................................4 mA
Preliminary
SS
DD
(4)
< 3.0V
................................................... -0.3V to (V
(4)
(4)
........................................ -0.3V to (V
................................................. -0.3V to +5.6V
DS70591C-page 353
DD
DD
+ 0.3V)
+ 0.3V)