DSPIC33FJ64GS606T-I/MR Microchip Technology, DSPIC33FJ64GS606T-I/MR Datasheet - Page 360

• Manufacturer Part Number: DSPIC33FJ64GS606T-I/MR
• Description: MCU/DSP 16BIT 64KB FLASH 64QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ64GS606T-I/MR

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 64-VFQFN, Exposed Pad
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
• Number Of I /o: 58
• Ram Size: 9K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Numeric And Arithmetic Format: Fixed-Point or Floating-Point
• Instruction Set Architecture: Harvard
• Device Million Instructions Per Second: 40 MIPs
• Maximum Clock Frequency: 120 MHz
• Number Of Programmable I/os: 58
• Data Ram Size: 4 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• On-chip Dac: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
TABLE 27-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
TABLE 27-11: ELECTRICAL CHARACTERISTICS: BOR
DS70591C-page 360
DC CHARACTERISTICS
DO10
DO16
DO20
DO26
DO27
DC CHARACTERISTICS
BO10
Note 1:
Param
Param
No.
No.
V
V
I
Symbol
SOURCE
OL
OH
Parameters are for design guidance only and are not tested in manufacturing.
V
Symbol
BOR
Output Low Voltage
I/O Ports:
OSC2/CLKO
Output High Voltage
I/O Ports:
OSC2/CLKO
Source Current
Pins:
Pins:
Pins:
Pins:
RA9, RA10, RD3-RD7, RD13,
RE0-RE7, RG12, RG13
RC15
RA0-RA7, RA14, RA15, RB0-
RB15, RC1-RC4, RC12-RC14,
RD0-RD2, RD8-RD12, RD14,
RD15, RE8, RE9, RF0-RF8,
RF12, RF13, RG0-RG3, RG6-
RG9, RG14, RG15
MCLR
4 mA Source/Sink Capability
8 mA Source/Sink Capability
16 mA Source/Sink Capability
4 mA Source/Sink Capability
8 mA Source/Sink Capability
16 mA Source/Sink Capability
BOR Event on V
High-to-Low
BOR Event is Tied to V
Voltage Decrease
Characteristic
Characteristic
DD
Transition
DD
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Core
Preliminary
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
2.40
2.40
2.40
2.41
Min
—
—
—
—
—
—
—
—
Min
2.6
Typ
(1)
—
—
—
—
—
—
—
—
—
—
—
—
-40°C  T
-40°C  T
Typ
—
Max
0.4
0.4
0.4
0.4
—
—
—
—
16
8
4
2
-40°C  T
-40°C  T
Max
2.95
A
A
Units
 +85°C for Industrial
 +125°C for Extended
mA
mA
mA
mA
V
V
V
V
V
V
V
V
 2010 Microchip Technology Inc.
A
A
Units
I
I
I
I
I
I
I
I
OL
OL
OL
OL
OH
OH
OH
OH
 +85°C for Industrial
 +125°C for Extended
V
= 4 mA, V
= 8 mA, V
= 16 mA, V
= 2 mA, V
= -4 mA, V
= -8 mA, V
= -16 mA, V
= -1.3 mA, V
Conditions
Conditions
DD
DD
DD
DD
DD
DD
DD
DD
= 3.3V
= 3.3V
= 3.3V
= 3.3V
= 3.3V
= 3.3V
= 3.3V
= 3.3V