DSPIC33FJ64GS606T-I/MR Microchip Technology, DSPIC33FJ64GS606T-I/MR Datasheet - Page 387

MCU/DSP 16BIT 64KB FLASH 64QFN

DSPIC33FJ64GS606T-I/MR

Manufacturer Part Number
DSPIC33FJ64GS606T-I/MR
Description
MCU/DSP 16BIT 64KB FLASH 64QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet

Specifications of DSPIC33FJ64GS606T-I/MR

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
64-VFQFN, Exposed Pad
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
Number Of I /o
58
Ram Size
9K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Numeric And Arithmetic Format
Fixed-Point or Floating-Point
Instruction Set Architecture
Harvard
Device Million Instructions Per Second
40 MIPs
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
58
Data Ram Size
4 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
On-chip Dac
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
TABLE 27-42: QEI INDEX PULSE TIMING REQUIREMENTS
FIGURE 27-22:
TABLE 27-43: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS
 2010 Microchip Technology Inc.
AC CHARACTERISTICS
TQ50
TQ51
TQ55
Note 1:
AC CHARACTERISTICS
TQ10
TQ11
TQ15
TQ20
Note 1:
Param
Param
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
No.
No.
2:
TtQH
TtQL
TtQP
T
TqIL
TqiH
Tqidxr
POSCNT
QEB
Symbol
CKEXTMRL
Symbol
These parameters are characterized but not tested in manufacturing.
Alignment of index pulses to QEA and QEB is shown for position counter Reset timing only. Shown for
forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but
index pulse recognition occurs on falling edge.
These parameters are characterized but not tested in manufacturing.
Filter Time to Recognize Low,
with Digital Filter
Filter Time to Recognize High,
with Digital Filter
Index Pulse Recognized to Position
Counter Reset (ungated index)
TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS
TQCK High Time
TQCK Low Time
TQCP Input
Period
Delay from External TxCK Clock
Edge to Timer Increment
Characteristic
Characteristic
Synchronous,
with prescaler
with prescaler
Synchronous,
with prescaler
Synchronous,
TQ10
(1)
(1)
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Preliminary
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
TQ15
2 * T
T
T
3 * N * T
3 * N * T
0.5 T
CY
CY
Min
CY
3 T
Min
+ 20
+ 20
CY
+ 40
CY
TQ11
CY
CY
-40°C  T
-40°C  T
Typ
Max
-40°C  T
-40°C  T
1.5 T
A
A
Max
 +125°C for Extended
 +85°C for Industrial
Units
ns
ns
ns
CY
A
A
TQ20
 +125°C for Extended
 +85°C for Industrial
Units
N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
ns
ns
ns
Must also meet
parameter TQ15
Must also meet
parameter TQ15
DS70591C-page 387
Conditions
Conditions

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