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DSPIC30F6012A-20E/PT
DSPIC30F6012A-20E/PT | |
|---|---|
| Manufacturer Part Number | DSPIC30F6012A-20E/PT |
| Description | IC DSPIC MCU/DSP 144K 64TQFP |
| Manufacturer | Microchip Technology |
| Series | dsPIC™ 30F |
| DSPIC30F6012A-20E/PT datasheets |
|
Availability: In stock
International delivery:
Warranty: 60 days
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Specifications of DSPIC30F6012A-20E/PT | |||
|---|---|---|---|
| Program Memory Type | FLASH | Program Memory Size | 144KB (48K x 24) |
| Package / Case | 64-TFQFP | Core Processor | dsPIC |
| Core Size | 16-Bit | Speed | 20 MIPS |
| Connectivity | CAN, I²C, SPI, UART/USART | Peripherals | AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT |
| Number Of I /o | 52 | Eeprom Size | 4K x 8 |
| Ram Size | 8K x 8 | Voltage - Supply (vcc/vdd) | 2.5 V ~ 5.5 V |
| Data Converters | A/D 16x12b | Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 125°C | Product | DSCs |
| Data Bus Width | 16 bit | Processor Series | DSPIC30F |
| Core | dsPIC | Maximum Clock Frequency | 20 MHz |
| Number Of Programmable I/os | 52 | Data Ram Size | 8 KB |
| Maximum Operating Temperature | + 125 C | Mounting Style | SMD/SMT |
| 3rd Party Development Tools | 52713-733, 52714-737, 53276-922, EWDSPIC | Development Tools By Supplier | PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011 |
| Minimum Operating Temperature | - 40 C | Package | 64TQFP |
| Device Core | dsPIC | Family Name | dsPIC30 |
| Maximum Speed | 20 MHz | Operating Supply Voltage | 3.3|5 V |
| Interface Type | CAN/I2C/SPI/UART | On-chip Adc | 16-chx12-bit |
| Number Of Timers | 5 | Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| For Use With | AC30F008 - MODULE SKT FOR DSPIC30F 64TQFP | ||
DSPIC30F2011-20ISO PDF datasheetDSPIC30F2011-20IP PDF datasheet #2DSPIC30F6011A-30IPT PDF datasheet #3DSPIC30F6011A-30IPT PDF datasheet #4DSPIC30F6011A-30IPT PDF datasheet #5DSPIC30F6011A-30IPT PDF datasheet #6DSPIC30F6011A-30IPT PDF datasheet #7DSPIC30F6011A-30IPT PDF datasheet #8DSPIC30F6014A-20EPT PDF datasheet #9
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5.2
Entering Enhanced ICSP Mode
The Enhanced ICSP mode is entered by holding PGC
and PGD high, and then raising MCLR/V
(high voltage), as illustrated in
Figure
5-2. In this mode,
the code memory, data EEPROM and Configuration
bits can be efficiently programmed using the program-
ming executive commands that are serially transferred
using PGC and PGD.
FIGURE 5-2:
ENTERING ENHANCED
ICSP™ MODE
P6
P7
V
IHH
MCLR/V
PP
V
DD
PGD
PGC
PGD = Input
Note 1: The sequence that places the device into
Enhanced ICSP mode places all unused
I/Os in the high-impedance state.
2: Before entering Enhanced ICSP mode,
clock switching must be disabled using
ICSP, by programming the FCKSM<1:0>
bits in the FOSC Configuration register to
‘11’ or ‘10’.
3: When in Enhanced ICSP mode, the SPI
output pin (SDO1) will toggle while the
device is being programmed.
DS70102K-page 6
5.3
Chip Erase
Before a chip can be programmed, it must be erased.
to V
The Bulk Erase command (ERASEB) is used to perform
PP
IHH
this task. Executing this command with the MS
command field set to 0x3 erases all code memory, data
EEPROM and code-protect Configuration bits. The
Chip Erase process sets all bits in these three memory
regions to ‘1’.
Since non-code-protect Configuration bits cannot be
erased, they must be manually set to ‘1’ using multiple
PROGC commands. One PROGC command must be
sent for each Configuration register (see
“Configuration Bits
If Advanced Security features are enabled, then indi-
vidual Segment Erase operations would need to be
performed, depending on which segment needs to be
programmed at a given stage of system programming.
The user should have the flexibility to select specific
segments for programming.
Note:
The Device ID registers cannot be erased.
These registers remain intact after a Chip
Erase is performed.
5.4
Blank Check
The term “Blank Check” means to verify that the device
has been successfully erased and has no programmed
memory cells. A blank or erased memory cell reads as
‘1’. The following memories must be blank checked:
• All implemented code memory
• All implemented data EEPROM
• All Configuration bits (for their default value)
The Device ID registers (0xFF0000:0xFF0002) can be
ignored by the Blank Check since this region stores
device information that cannot be erased. Additionally,
all unimplemented memory space should be ignored
from the Blank Check.
The QBLANK command is used for the Blank Check. It
determines if the code memory and data EEPROM are
erased by testing these memory regions. A ‘BLANK’ or
‘NOT BLANK’ response is returned. The READD
command is used to read the Configuration registers. If
it is determined that the device is not blank, it must be
erased (see
Section 5.3 “Chip
attempting to program the chip.
Section 5.7
Programming”).
Erase”) before
© 2010 Microchip Technology Inc.
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