DSPIC30F6012-20E/PF Microchip Technology, DSPIC30F6012-20E/PF Datasheet - Page 59

IC DSPIC MCU/DSP 144K 64TQFP

DSPIC30F6012-20E/PF

Manufacturer Part Number
DSPIC30F6012-20E/PF
Description
IC DSPIC MCU/DSP 144K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F6012-20E/PF

Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TQFP, 64-VQFP
For Use With
XLT64PT4 - SOCKET TRAN ICE 64MQFP/TQFPAC164313 - MODULE SKT FOR PM3 64PFAC30F002 - MODULE SOCKET DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F601220EPF

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F6012-20E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
TABLE 13-1:
© 2010 Microchip Technology Inc.
AC/DC CHARACTERISTICS
P9b
P10
P11
P12a
P12b
P13a
P13b
Param.
No.
T
T
T
T
T
T
T
ERA
ERA
DLY
DLY
DLY
PROG
PROG
Sym
5
6
7
AC/DC CHARACTERISTICS (CONTINUED)
Delay between PGD ↓ by programming
executive to PGD released by
programming executive
Delay between PGD released by
programming executive to first PGC ↑ of
response
Delay between clocking out response
words
Row Programming cycle time
Row Programming cycle time
Bulk/Row Erase cycle time
Bulk/Row Erase cycle time
Characteristic
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
Min
0.8
0.8
15
10
5
1
1
Max
2.6
2.6
4
4
Units
ms
ms
ms
ms
μs
μs
μs
DS70102K-page 59
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
Conditions

Related parts for DSPIC30F6012-20E/PF