STM32F103ZET6TR STMicroelectronics, STM32F103ZET6TR Datasheet - Page 101

• Manufacturer Part Number: STM32F103ZET6TR
• Description: MCU 32BIT ARM 512K FLASH 100-LQF
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103ZET6TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 112
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 21x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 112
• Number Of Timers: 11
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32F103ZE, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 21 Channel
• On-chip Dac: 12 bit, 2 Channel
• Cpu Family: STM32
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 112
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

STM32F103xC, STM32F103xD, STM32F103xE
Figure 54. Typical connection diagram using the ADC
1. Refer to
2. C
General PCB design guidelines
Power supply decoupling should be performed as shown in
depending on whether V
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 55. Power supply and reference decoupling (V
1. V
pad capacitance (roughly 7 pF). A high C
this, f
REF+
parasitic
ADC
V AIN
and V
Table 58
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
should be reduced.
R AIN (1)
REF–
1 µF // 10 nF
for the values of R
inputs are available only on 100-pin packages.
C parasitic
AINx
REF+
is connected to V
Doc ID 14611 Rev 7
AIN
V DD
1 µF // 10 nF
, R
parasitic
ADC
0.6 V
0.6 V
V T
V T
and C
value will downgrade conversion accuracy. To remedy
ADC
I L ±1 µA
DDA
.
or not. The 10 nF capacitors should be
V
V
STM32F103xx
V
(see note 1)
R ADC (1)
DDA
SSA
Sample and hold ADC
converter
REF+
/V
(see note 1)
REF+
Figure 55
REF–
C ADC (1)
STM32F103xx
not connected to
converter
Electrical characteristics
12-bit
or
Figure
ai14388b
56,
ai14150c
V
DDA
101/123
)