N80C251SQ16 Intel, N80C251SQ16 Datasheet - Page 15

• Manufacturer Part Number: N80C251SQ16
• Description: IC MPU 8-BIT 5V 16MHZ 44-PLCC
• Manufacturer: Intel
• Series: 80Cr

Specifications of N80C251SQ16

• Rohs Status: RoHS non-compliant
• Core Processor: MCS 251
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: SIO
• Peripherals: PWM, WDT
• Number Of I /o: 32
• Program Memory Type: ROMless
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 44-PLCC
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Other names: 804459

5.0 ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
Storage Temperature ................................... -65°C to +150°C
Voltage on EA#/V
Voltage on Any other Pin to V
I
Power Dissipation .......................................................... 1.5 W
OPERATING CONDITIONS
T
V
V
OL
A
CC
SS
PRELIMINARY
(Ambient Temperature Under Bias):
per I/O Pin ................................................................. 15 mA
..................................................................................... 0 V
(Digital Supply Voltage) .............................. 4.5 V to 5.5 V
Commercial ................................................. 0°C to +70°C
Express .................................................... -40°C to +85°C
Maximum power dissipation is
based on package heat-transfer
limitations, not device power
consumption.
PP
8XC251SA/SB/SP/SQ HIGH-PERFORMANCE CHMOS MICROCONTROLLER
Pin to V
NOTE
SS
SS
......................... 0 V to +13.0 V
..................... -0.5 V to +6.5 V
†
NOTICE: This document contains preliminary
information on new products in production. The
specifications are subject to change without notice.
Verify with your local Intel sales office that you
have the latest datasheet before finalizing a
design.
†
“Absolute Maximum Ratings” may cause perma-
nent damage. These are stress ratings only. Oper-
ation beyond the “Operating Conditions” is not
recommended and extended exposure beyond the
“Operating Conditions” may affect device
reliability.
WARNING: Stressing the device beyond the
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