MC68711E20CFNE3 Freescale Semiconductor, MC68711E20CFNE3 Datasheet - Page 122

• Manufacturer Part Number: MC68711E20CFNE3
• Description: IC MCU 8BIT 52-PLCC
• Manufacturer: Freescale Semiconductor
• Series: HC11r

Specifications of MC68711E20CFNE3

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number Of I /o: 38
• Program Memory Size: 20KB (20K x 8)
• Program Memory Type: OTP
• Eeprom Size: 512 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 52-PLCC
• Processor Series: M687xx
• Core: HC11
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 3 MHz
• Number Of Programmable I/os: 38
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information and Mechanical Specifications
10.4 44-Pin PLCC (Case 777-02)
122
-L-
C
0.010 (0.25)
Z
44
G
G1
S
A
R
T
1
L-M
-N-
V
NOTES:
1. DATUMS -L-, -M-, AND -N- ARE DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSION R AND U DO NOT INCLUDE MOLD
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMINSION H DOES NOT INCLUDE DAMBAR
S
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM -T-, SEATING PLANE.
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETERMINED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940124). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
N S
E
Y
BRK
-M-
0.007(0.180)
0.007(0.180)
W
MC68HC711D3 Data Sheet, Rev. 2.1
J
VIEW S
D
D
-T-
M
M
T
T
0.004 (0.10)
SEATING
PLANE
L-M
L-M
S
S
DIM
G1
K1
W
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
N S
N S
0.042
MIN
0.685
0.685
0.165
0.090
0.013
0.026
0.020
0.025
0.650
0.650
0.042
0.042
0.610
0.040
2°
0.050 BSC
INCHES
B
X
Z
K
VIEW D-D
MAX
0.695
0.695
0.180
0.110
0.019
0.032
0.656
0.656
0.048
0.048
0.056
0.020
0.630
10°
U
VIEW S
0.007(0.180)
H
17.40
17.40
16.51
16.51
15.50
MIN
MILLIMETERS
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
2°
1.27 BSC
0.007(0.180)
0.007(0.180)
MAX
F
17.65
17.65
16.66
16.66
16.00
10°
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
K1
M
0.007(0.180)
G1
0.010 (0.25)
T
M
M
L-M
Freescale Semiconductor
T
T
S
M
L-M
L-M
S
N S
T
T
S
S
L-M
L-M
N S
N S
S
S
N S
N S