NCV2002SN2T1G ON Semiconductor, NCV2002SN2T1G Datasheet - Page 16

• Manufacturer Part Number: NCV2002SN2T1G
• Description: IC OPAMP R-R 0.9V 1A 6-TSOP
• Manufacturer: ON Semiconductor

Specifications of NCV2002SN2T1G

• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 1.3 V/µs
• Gain Bandwidth Product: 900kHz
• Current - Input Bias: 10pA
• Voltage - Input Offset: 500µV
• Current - Supply: 820µA
• Current - Output / Channel: 128mA
• Voltage - Supply, Single/dual (±): 0.9 V ~ 7 V, ±0.45 V ~ 3.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SC-74-6
• Number Of Channels: 1
• Voltage Gain Db: 92.04 dB
• Common Mode Rejection Ratio (min): 60 dB
• Input Voltage Range (max): Positive Rail
• Input Voltage Range (min): Negative Rail
• Input Offset Voltage: 6 mV
• Operating Supply Voltage: 7 V
• Supply Current: 2 uA
• Maximum Power Dissipation: 340 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Maximum Dual Supply Voltage: +/- 3.5 V
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Details
• Other names: NCV2002SN2T1G; NCV2002SN2T1GOSTR

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0.05 (0.002)
H
E
e
A1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
6
1
D
5
2
0.075
*For additional information on our Pb−Free strategy and soldering
3
4
1.9
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
b
0.037
0.037
0.95
0.95
A
E
SOLDERING FOOTPRINT*
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
http://onsemi.com
L
CASE 318G−02
ISSUE S
TSOP−6
0.094
2.4
c
16
q
0.039
1.0
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. DIMENSIONS A AND B DO NOT INCLUDE
DIM
H
A1
SCALE 10:1
ANSI Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
b
D
E
L
q
c
e
E
0.028
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0.7
0°
MILLIMETERS
inches
NOM
1.00
0.06
0.38
0.18
3.00
1.50
0.95
0.40
2.75
mm
−
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.10
0.10
0.50
0.26
3.10
1.70
1.05
0.60
3.00
10°
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
MIN
0°
INCHES
0.039
0.002
0.014
0.007
0.059
0.037
0.016
0.108
NOM
0.118
−
NCS2002/D
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
MAX
10°