MMBZ5V6AL,215 NXP Semiconductors, MMBZ5V6AL,215 Datasheet

DIODE ESD PROT DBL 3V SOT23

MMBZ5V6AL,215

Manufacturer Part Number
MMBZ5V6AL,215
Description
DIODE ESD PROT DBL 3V SOT23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of MMBZ5V6AL,215

Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Power (watts)
24W
Polarization
2 Channel Array - Unidirectional
Voltage - Breakdown
5.32V
Voltage - Reverse Standoff (typ)
3V
Clamping Voltage
8 V
Current Rating
3 A
Channels
1 Channel
Breakdown Voltage
5.6 V
Capacitance
210 pF
Termination Style
Solder Tail
Power Dissipation Pd
290 mW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMBZ5V6AL,215
Manufacturer:
NXP/恩智浦
Quantity:
20 000
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
Unidirectional double ElectroStatic Discharge (ESD) protection diodes in a common
anode configuration, encapsulated in a SOT23 (TO-236AB) small Surface-Mounted
Device (SMD) plastic package. The devices are designed for ESD and transient
overvoltage protection of up to two signal lines.
Table 1.
Type number
MMBZ5V6AL
MMBZ6V2AL
MMBZ6V8AL
MMBZ9V1AL
MMBZ10VAL
MMBZ12VAL
MMBZ15VAL
MMBZ18VAL
MMBZ20VAL
MMBZ27VAL
MMBZ33VAL
MMBZxAL series
Low capacitance unidirectional double ESD protection diodes
Rev. 02 — 10 December 2009
Unidirectional ESD protection of
two lines
Bidirectional ESD protection of one line
Low diode capacitance: C
Rated peak pulse power: P
Ultra low leakage current: I
Computers and peripherals
Audio and video equipment
Cellular handsets and accessories
Product overview
Package
NXP
SOT23
d
RM
PPM
≤ 280 pF
= 5 nA
= 40 W
JEDEC
TO-236AB
ESD protection up to 30 kV (contact
discharge)
IEC 61000-4-2; level 4 (ESD)
IEC 61643-321
AEC-Q101 qualified
Automotive electronic control units
Portable electronics
Product data sheet
Configuration
dual common anode

Related parts for MMBZ5V6AL,215

MMBZ5V6AL,215 Summary of contents

Page 1

MMBZxAL series Low capacitance unidirectional double ESD protection diodes Rev. 02 — 10 December 2009 1. Product profile 1.1 General description Unidirectional double ElectroStatic Discharge (ESD) protection diodes in a common anode configuration, encapsulated in a SOT23 (TO-236AB) small Surface-Mounted ...

Page 2

... NXP Semiconductors 1.4 Quick reference data Table amb Symbol Per diode V RWM Pinning information Table 3. Pin MMBZXAL_SER_2 Product data sheet Low capacitance unidirectional double ESD protection diodes Quick reference data ° C unless otherwise specified. Parameter Conditions reverse standoff voltage MMBZ5V6AL MMBZ6V2AL ...

Page 3

... NXP Semiconductors 3. Ordering information Table 4. Type number MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL 4. Marking Table 5. Type number MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia ...

Page 4

... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode P PPM I PPM Per device P tot MMBZXAL_SER_2 Product data sheet Low capacitance unidirectional double ESD protection diodes Limiting values Parameter Conditions rated peak pulse power ...

Page 5

... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol amb T stg In accordance with IEC 61643-321 (10/1000 μs current waveform). [1] [2] Measured from pin pin 3. [3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...

Page 6

... NXP Semiconductors 150 I PP (%) ; 10 μs 100 % I 100 1.0 2.0 10/1000 μs pulse waveform according to Fig 1. IEC 61643-321 MMBZXAL_SER_2 Product data sheet Low capacitance unidirectional double ESD protection diodes 006aab319 ; 1000 μs 3.0 4.0 t (ms) p Fig 2. Rev. 02 — 10 December 2009 MMBZxAL series ...

Page 7

... NXP Semiconductors 6. Thermal characteristics Table 9. Symbol Per device R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [3] Measured from pin pin 3. MMBZXAL_SER_2 Product data sheet ...

Page 8

... NXP Semiconductors 7. Characteristics Table 10 amb Symbol Per diode RWM MMBZXAL_SER_2 Product data sheet Low capacitance unidirectional double ESD protection diodes Characteristics ° C unless otherwise specified. Parameter Conditions forward voltage reverse standoff voltage MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL ...

Page 9

... NXP Semiconductors Table 10 amb Symbol accordance with IEC 61643-321(10/1000 μs current waveform). [1] [2] Measured from pin pin 3. MMBZXAL_SER_2 Product data sheet Low capacitance unidirectional double ESD protection diodes Characteristics …continued ° C unless otherwise specified. Parameter Conditions diode capacitance MHz; V MMBZ5V6AL MMBZ6V2AL ...

Page 10

... NXP Semiconductors PPM ( −2 − °C T amb unidirectional and bidirectional Fig 3. Rated peak pulse power as a function of exponential pulse duration (rectangular waveform); typical values 250 C d (pF) 200 150 (1) 100 ( ° MHz; T amb (1) MMBZ5V6AL: unidirectional (2) MMBZ5V6AL: bidirectional (3) MMBZ6V8AL: unidirectional (4) MMBZ6V8AL: bidirectional Fig 5. ...

Page 11

... NXP Semiconductors (1) MMBZ5V6AL RWM (2) MMBZ6V8AL 4.5 V RWM (3) MMBZ9V1AL RWM (4) MMBZ27VAL RWM Fig 7. Reverse leakage current as a function of ambient temperature; typical values −V −V − RWM − + P-N Fig 8. V-I characteristics for a unidirectional ESD protection diode MMBZXAL_SER_2 Product data sheet Low capacitance unidirectional double ESD protection diodes ...

Page 12

... NXP Semiconductors 8. Application information The MMBZxAL series is designed for the protection two unidirectional data or signal lines from the damage caused by ESD and surge pulses. The devices may be used on lines where the signal polarities are either positive or negative with respect to ground. The MMBZ5V6AL, MMBZ6V2AL, MMBZ6V8AL, MMBZ9V1AL and MMBZ10VAL provide ...

Page 13

... NXP Semiconductors 10. Package outline Fig 11. Package outline SOT23 (TO-236AB) 11. Packing information Table 11. The indicated -xxx are the last three digits of the 12NC ordering code. Type number MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL [1] For further information and the availability of packing methods, see ...

Page 14

... NXP Semiconductors 12. Soldering 3 1.7 Fig 12. Reflow soldering footprint SOT23 (TO-236AB) 2.6 4.6 Fig 13. Wave soldering footprint SOT23 (TO-236AB) MMBZXAL_SER_2 Product data sheet Low capacitance unidirectional double ESD protection diodes 3.3 2.9 1.9 0.7 (3×) 0.5 (3×) 0.6 (3×) 1 2.2 1.2 (2×) 1.4 (2× ...

Page 15

... NXP Semiconductors 13. Revision history Table 12. Revision history Document ID Release date MMBZXAL_SER_2 20091210 • Modifications: Type numbers MMBZ5V6AL, MMBZ6V2AL, MMBZ6V8AL, MMBZ9V1AL and MMBZ10VAL added • Type numbers MMBZ12VAL/DG, MMBZ15VAL/DG, MMBZ18VAL/DG, MMBZ20VAL/DG, MMBZ27VAL/DG, MMBZ33VAL/DG removed • Figure 5 • Figure • Figure • Section 14 “Legal ...

Page 16

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 17

... NXP Semiconductors 16. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 7 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . 12 9.1 Quality information . . . . . . . . . . . . . . . . . . . . . 12 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 11 Packing information ...

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