DSP56311VF150R2 Freescale Semiconductor, DSP56311VF150R2 Datasheet - Page 72

• Manufacturer Part Number: DSP56311VF150R2
• Description: IC DSP 24BIT 150MHZ 196-BGA
• Manufacturer: Freescale Semiconductor
• Series: DSP563xxr
• Type: Fixed Pointr

Specifications of DSP56311VF150R2

• Interface: Host Interface, SSI, SCI
• Clock Rate: 150MHz
• Non-volatile Memory: ROM (576 B)
• On-chip Ram: 384kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.80V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 196-MAPBGA
• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 150MHz
• Mips: 150
• Device Input Clock Speed: 150MHz
• Ram Size: 384KB
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (min): 1.7/1.7/3/3/3/3/3/3V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Design Considerations
As noted earlier, the junction-to-case thermal resistances quoted in this data sheet are determined using the first
definition. From a practical standpoint, that value is also suitable to determine the junction temperature from a case
thermocouple reading in forced convection environments. In natural convection, the use of the junction-to-case
thermal resistance to estimate junction temperature from a thermocouple reading on the case of the package will
yield an estimate of a junction temperature slightly higher than actual temperature. Hence, the new thermal metric,
thermal characterization parameter or Ψ
of the junction temperature in natural convection when the surface temperature of the package is used. Remember
that surface temperature readings of packages are subject to significant errors caused by inadequate attachment of
the sensor to the surface and to errors caused by heat loss to the sensor. The recommended technique is to attach a
40-gauge thermocouple wire and bead to the top center of the package with thermally conductive epoxy.
4.2 Electrical Design Considerations
Use the following list of recommendations to ensure correct DSP operation.
4-2
•
•
•
•
•
•
•
To minimize temperature variation across the surface, the thermal resistance is measured from the junction
to the outside surface of the package (case) closest to the chip mounting area when that surface has a
proper heat sink.
To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance is
measured from the junction to the point at which the leads attach to the case.
If the temperature of the package case (T
computed from the value obtained by the equation (T
Provide a low-impedance path from the board power supply to each
board ground to each
Use at least four 0.01–0.1 µF bypass capacitors for the core and PLL power and six 0.01–0.1 µF bypass
capacitors for I/O power positioned as closely as possible to the four sides of the package to connect the
V
Ensure that capacitor leads and associated printed circuit traces that connect to the chip
are less than 0.5 inch per capacitor lead.
Use at least a four-layer PCB with two inner layers for
CC
power source to
GND
GND
This device contains protective circuitry to
guard against damage due to high static
voltage or electrical fields. However, normal
precautions are advised to avoid application
of any voltages higher than maximum rated
voltages to
Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage
level (for example, either GND or V
.
pin.
JT
DSP56311 Technical Data, Rev. 8
, has been defined to be (T
this high-impedance circuit.
T
) is determined by a thermocouple, thermal resistance is
CAUTION
J
– T
V
CC
T
)/P
and
J
– T
D
CC
.
GND
T
).
)/P
.
V
D
CC
. This value gives a better estimate
pin on the DSP and from the
Freescale Semiconductor
V
CC
and
GND
pins