DSP56321VF220 Freescale Semiconductor, DSP56321VF220 Datasheet - Page 22

• Manufacturer Part Number: DSP56321VF220
• Description: IC DSP 24BIT 220MHZ 196-BGA
• Manufacturer: Freescale Semiconductor
• Series: DSP563xxr
• Type: Fixed Pointr

Specifications of DSP56321VF220

• Interface: Host Interface, SSI, SCI
• Clock Rate: 220MHz
• Non-volatile Memory: ROM (576 B)
• On-chip Ram: 576kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.60V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: *
• Package / Case: 196-MAPBGA
• Device Core Size: 24b
• Format: Fixed Point
• Clock Freq (max): 220MHz
• Mips: 220
• Device Input Clock Speed: 220MHz
• Ram Size: 576KB
• Operating Supply Voltage (typ): 1.6/3.3V
• Operating Supply Voltage (min): 1.5/3/3/3/3/3/3V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MA-BGA
• Package: 196MA-BGA
• Numeric And Arithmetic Format: Fixed-Point
• Maximum Speed: 220 MHz
• Device Million Instructions Per Second: 220 MIPS
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Specifications
2.2 Thermal Characteristics
2.3 DC Electrical Characteristics
2-2
Supply voltage
•
•
Input high voltage
•
•
•
Input low voltage
•
•
•
Input leakage current
High impedance (off-state) input current
(@ 2.4 V / 0.4 V)
Output high voltage
•
•
Output low voltage
•
•
Junction-to-ambient, natural convection, single-layer board (1s)
Junction-to-ambient, natural convection, four-layer board (2s2p)
Junction-to-ambient, @200 ft/min air flow, single-layer board (1s)
Junction-to-ambient, @200 ft/min air flow, four-layer board (2s2p)
Junction-to-board
Junction-to-case thermal resistance
Notes:
Core (V
I/O (V
D[0–23], BG, BB, TA
MOD/IRQ
JTAG/ESSI/SCI/Timer/HI08 pins
EXTAL
D[0–23], BG, BB, TA, MOD/IRQ
All JTAG/ESSI/SCI/Timer/HI08 pins
EXTAL
TTL (I
CMOS (I
TTL (I
CMOS (I
CCQH
OH
OL
1.
2.
3.
4.
5.
9
9
CCQL
OH
OL
= 3.0 mA)
= –0.4 mA)
2
, V
1
RESET, PINIT/NMI and all
= 10 µA)
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
= –10 µA)
:
)
CCA
4
8
8
, V
6
6
CCD
6
Characteristics
6
Thermal Resistance Characteristic
, V
CCC
, V
2
5
, RESET, PINIT
CCH
, and V
Table 2-3.
Table 2-2.
CCS
DSP56321 Technical Data, Rev. 11
)
DC Electrical Characteristics
1,2
Thermal Characteristics
1,3
1,3
1,3
Symbol
V
V
V
V
V
V
V
I
V
I
TSI
IHP
IHX
ILP
ILX
IN
OH
OL
IH
IL
V
0.8 × V
CCQH
Min
–0.3
–0.3
–0.3
–10
–10
1.5
3.0
2.0
2.0
2.4
—
—
– 0.01
CCQH
7
Symbol
R
R
R
R
R
R
θJMA
θJMA
θJMA
θJA
θJB
θJC
Typ
1.6
3.3
—
—
—
—
—
—
—
—
—
—
—
—
Freescale Semiconductor
MAP-BGA
Value
0.2 × V
V
V
44
25
35
22
13
CCQH
CCQH
7
V
Max
0.01
CCQH
1.7
3.6
0.8
0.8
0.4
10
10
—
—
+ 0.3
+ 0.3
CCQH
°
°
°
°
°
°
Unit
C/W
C/W
C/W
C/W
C/W
C/W
Unit
µA
µA
V
V
V
V
V
V
V
V
V
V
V
V