73S1209F-44IM/F Maxim Integrated Products, 73S1209F-44IM/F Datasheet - Page 8

• Manufacturer Part Number: 73S1209F-44IM/F
• Description: IC SMART CARD READER 44-QFN
• Manufacturer: Maxim Integrated Products

Specifications of 73S1209F-44IM/F

• Core Processor: 80515
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: I²C, SmartCard, UART/USART
• Peripherals: LED, POR, WDT
• Number Of I /o: 9
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

73S12xxF Software User Guide
 CCIDTSC-*.sys/CCIDTSC-*.inf – Teridian Windows Drivers.
 ccidusb-*.hex – an embedded application used for USB CCID communications with Windows or
 ccidrs232.hex – an embedded application used for RS232/Serial communications with a host
 CCID-USB.exe – a PC application written in C# to be used in conjunction with the CCIDTeridian.sys
 Low-level API Library – an embedded flash module that provides low-level APIs (physical layer) to
 High-level API Library – an embedded flash module at the protocol level that provides APIs to control
 Include/header files for both the Low-level API and the High-level API libraries.
 Sample code for Serial’s Pseudo CCID protocol. For the USB interface, the USB CCID firmware
 Linux driver for USB CCID and Linux Application for USB DFU interface.
2.2
Install the Keil compiler and select all default options (recommended). When prompted for a target
device, select TSC-73S12xxF. This option may not be available on older versions of the compiler. In this
case, select TSC 73M6513. For development, an upgrade to a newer version of the Keil compiler is
highly recommended. This option can be changed at any time by:
2.2.1 Software Architecture
The 73S12xxF software architecture is partitioned into three separate layers:
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•
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Figure 1
illustrated, there are many different ways an application can be designed and implemented.
Design Reference
application sample source code for most of the main features of the chip is provided in the release.
8
Linux OS. This embedded program can be used with either Microsoft’s generic USB driver or the
Teridian driver.
running Windows OS.
USB driver with the evaluation board programmed with the CCIDUSB-*.hex firmware.
control the 73S12xxF.
different features of the Smart Card. EMV Level I protocol layer is implemented within this module.
source code is also included.
Under ‘Project’ – ‘Select Device for target ‘Target1’ ‘– CPU tab’ – scroll down to TDK Semiconductor
(with older version of Keil) or Teridian Semiconductor (available with newer version of Keil) – select
either 71M6513 or 73S12xx.
Under ‘Project’ – ‘Options for target ‘target1’’ – Target tab – Xdata memory field, the RAM start
address should be set to 0x0000, and RAM size should be set to 0x0800.
The Low-level API (LAPI) device or physical layer, which contains a set of function calls to directly
manage the peripherals and CPU management (such as clock, timing, power saving, etc.).
The second layer is the High-level API (HAPI), which is essentially the protocol layer. It provides
functions for communication with the smart card (ICC).
The third layer is the application layer. This layer is left for the application software developer to
design any suitable smart card reader applications.
Software Build Environment
shows the partitions for each software component and its approximate memory size. As
describes the API functions within each component in more detail. The embedded
UG_12xxF_016
Section 4
Rev. 1.50