TJA1043T,112 NXP Semiconductors, TJA1043T,112 Datasheet
TJA1043T,112
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TJA1043T,112 Summary of contents
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TJA1043 High-speed CAN transceiver Rev. 01 — 30 March 2010 1. General description The TJA1043 is a high-speed CAN transceiver that provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus. The transceiver ...
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... NXP Semiconductors 2.3 Protection and diagnosis (detection and signalling) High ESD handling capability on the bus pins Bus pins and V Transmit Data (TXD) dominant time-out function with diagnosis TXD-to-RXD short-circuit handler with diagnosis Thermal protection with diagnosis Undervoltage detection and recovery on pins V ...
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... NXP Semiconductors 4. Block diagram TXD V BAT 9 WAKE 8 ERR_N 14 STB_N RXD Fig 1. Block diagram TJA1043_1 Product data sheet TEMPERATURE PROTECTION SLOPE CONTROL + TIME-OUT DRIVER MODE SPLIT CONTROL + WAKE-UP CONTROL + ERROR DETECTION MUX + DRIVER WAKE-UP FILTER 2 GND All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 2. 5.2 Pin description Table 2. Symbol TXD GND V CC RXD INH ERR_N WAKE V BAT SPLIT CANL CANH STB_N 6. Functional description The TJA1043 is a stand-alone high-speed CAN transceiver with a number of operating modes, fail-safe features and diagnostic features that offer enhanced system reliability and advanced power management ...
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... NXP Semiconductors 6.1 Operating modes The TJA1043 supports five operating modes. Control pins STB_N and EN are used to select the operating mode. Switching between modes allows access to a number of diagnostics flags via pin ERR_N. Figure 3 Table 3. Internal flags [1] UV NOM From Normal, Listen-only, Standby and Go-to-Sleep modes ...
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... NXP Semiconductors STB_N = H and LEGEND Fig 3. 6.1.1 Normal mode In Normal mode, the transceiver can transmit and receive data via the bus lines CANH and CANL (see analog data on the bus lines into digital data which is output to pin RXD. The slope of the output signals on the bus lines is controlled and optimized in a way that guarantees the lowest possible EME ...
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... NXP Semiconductors 6.1.3 Standby mode Standby mode is the TJA1043’s first-level power saving mode, offering reduced current consumption. In Standby mode, the transceiver is unable to transmit or receive data and the low-power receiver is activated to monitor bus activity. The bus pins are biased at ground level (via R also be active ...
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... NXP Semiconductors Table 4. Internal flag Wake-up source Bus failure Local failure in Listen-only mode (coming from Normal [1] Pin ERR_N is an active-LOW output LOW-level indicates a set flag and a HIGH-level indicates a cleared flag. Allow pin ERR_N to stabilize for at least 8 μs after changing operating modes. ...
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... NXP Semiconductors pattern is completed within t Go-to-Sleep mode or Sleep mode. Setting the Wake flag clears the UV timers. Once set, the Wake flag status is immediately available on pins ERR_N and RXD (provided V the UV NOM 6.2.5 Wake-up source flag Wake-up source recognition is provided via the Wake-up source flag, which is set when the Wake flag is set by a local wake-up request via the WAKE pin ...
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... NXP Semiconductors 6.3.3 Bus dominant clamping detection A CAN bus short circuit (to V nodes could result in a differential voltage on the bus high enough to represent a bus dominant state. Because a node will not start transmission if the bus is dominant, the normal bus failure detection will not detect this failure, but the bus dominant clamping detection will ...
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... NXP Semiconductors 6.6 WAKE pin A local wake-up event is triggered by a LOW-to-HIGH or HIGH-to-LOW transition on the WAKE pin, allowing for maximum flexibility when designing a local wake-up circuit.To minimize current consumption, the internal bias voltage will follow the logic state on the pin after a delay of t ...
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... NXP Semiconductors 7. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V BAT WAKE V trt V ESD stg [1] Verified by an external test house to ensure pins CANH, CANL, SPLIT and V part 3 automotive transient test pulses 1, 2a, 3a and 3b. ...
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... NXP Semiconductors 8. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter R thermal resistance from virtual junction to ambient th(vj-a) [1] Value is determined for free convection conditions on a JEDEC 2S2P board. 9. Static characteristics Table 7. Static characteristics specified; all voltages are defined with respect to ground; positive currents flow into the device ...
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... NXP Semiconductors Table 7. Static characteristics specified; all voltages are defined with respect to ground; positive currents flow into the device Symbol Parameter I HIGH-level output current OH I LOW-level output current OL Standby and enable control inputs; pins STB_N and EN V HIGH-level input voltage ...
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... NXP Semiconductors Table 7. Static characteristics specified; all voltages are defined with respect to ground; positive currents flow into the device Symbol Parameter R input resistance i ΔR input resistance deviation i R differential input resistance i(dif) C common-mode input i(cm) capacitance C differential input i(dif) capacitance Common-mode stabilization output ...
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... NXP Semiconductors Table 8. Dynamic characteristics specified; all voltages are defined with respect to ground; positive currents flow into the device Symbol Parameter t bus recessive wake-up time wake(busrec) t bus wake-up time-out time to(wake)bus t wake-up time wake [1] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range ...
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... NXP Semiconductors 11. Application information Fig 6. TJA1043_1 Product data sheet 5 V BAT V INH BAT 10 7 WAKE 9 TJA1043 GND 2 13 CANH CAN bus wires Typical application with 3 V microcontroller All information provided in this document is subject to legal disclaimers. Rev. 01 — 30 March 2010 High-speed CAN transceiver ...
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... NXP Semiconductors 12. Test information Fig 7. Fig 8. 12.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1043_1 Product data sheet V RXD hysteresis 0.5 Hysteresis of the receiver + μF 100 nF ...
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... NXP Semiconductors 13. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 10. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. TJA1043_1 Product data sheet maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature MSL: Moisture Sensitivity Level All information provided in this document is subject to legal disclaimers ...
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... NXP Semiconductors 15. Revision history Table 11. Revision history Document ID Release date TJA1043_1 20100330 TJA1043_1 Product data sheet Data sheet status Change notice Product specification - All information provided in this document is subject to legal disclaimers. Rev. 01 — 30 March 2010 TJA1043 High-speed CAN transceiver Supersedes - © NXP B.V. 2010. All rights reserved. ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors 17. Contact information For more information, please visit: For sales office addresses, please send an email to: TJA1043_1 Product data sheet http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 01 — 30 March 2010 TJA1043 High-speed CAN transceiver © NXP B.V. 2010. All rights reserved. ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Low-power management . . . . . . . . . . . . . . . . . 1 2.3 Protection and diagnosis (detection and signalling Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5 6.1.1 Normal mode ...