BGA2717,115 NXP Semiconductors, BGA2717,115 Datasheet
BGA2717,115
Specifications of BGA2717,115
934058246115
BGA2717 T/R
Related parts for BGA2717,115
BGA2717,115 Summary of contents
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BGA2717 MMIC wideband amplifier Rev. 02 — 24 September 2004 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 SMD plastic package. CAUTION This device is sensitive ...
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Philips Semiconductors 2. Pinning information Table 2: Pin Ordering information Table 3: Type number BGA2717 4. Marking Table 4: Type number BGA2717 5. Limiting values Table 5: In accordance with the Absolute Maximum ...
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Philips Semiconductors 6. Thermal characteristics Table 6: Symbol R th(j-sp) 7. Characteristics Table Symbol L(sat) ...
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Philips Semiconductors 8. Application information Figure 1 internally matched and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF ...
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Philips Semiconductors Fig 2. PCB layout and demonstration board showing components. 8.1 Grounding and output impedance If the grounding is not optimal, the gain becomes less flat and the 50 becomes worse better output matching ...
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Philips Semiconductors Fig 3. Application circuit for better output impedance into 50 . 8.2 Application examples The MMIC is very suitable as IF amplifier in e.g. LNBs. The excellent wideband characteristics make it an ideal building block (see LNA, the ...
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Philips Semiconductors Fig 6. Input reflection coefficient (s Fig 7. Output reflection coefficient (s 9397 750 13293 Product data sheet 135 0.5 0.2 0 0.2 0.5 180 0.2 0.5 135 mA ...
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Philips Semiconductors (dB 1000 2000 mA dBm Fig 8. Isolation ( function ...
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Philips Semiconductors 4 NF (dB) 3 (3) (2) ( 500 1000 1500 ( 8 ...
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Philips Semiconductors Table 8: Scattering parameters mA dBm (MHz Magnitude Angle (ratio) (deg) 100 0.074378 13.78537 200 0.076338 13.70153 400 0.123748 1.402521 600 ...
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Philips Semiconductors 9. Package outline Plastic surface mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.20 0.8 0.10 ...
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Philips Semiconductors 10. Revision history Table 9: Revision history Document ID Release date BGA2717_2 20040924 • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors BGA2717_N_1 20040202 ...
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Philips Semiconductors 11. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 15. Contents 1 Product profi 1.1 General description ...