AMMP-6233-BLKG Avago Technologies US Inc., AMMP-6233-BLKG Datasheet - Page 7

• Manufacturer Part Number: AMMP-6233-BLKG
• Description: IC MMIC LNA 18GHZ-31GHZ 8SMD
• Manufacturer: Avago Technologies US Inc.
• Type: Low Noise Amplifierr

Specifications of AMMP-6233-BLKG

• Rf Type: VSAT, DBS
• Gain: 23.2dB
• Current - Supply: 65mA
• Frequency: 18GHz ~ 32GHz
• Noise Figure: 2.6dB
• P1db: 8dBm
• Package / Case: 8-SMD
• Test Frequency: 18GHz
• Voltage - Supply: 3 V ~ 5 V
• Frequency Rf: 32GHz
• Noise Figure Typ: 2.6dB
• Supply Current: 65mA
• Supply Voltage Range: 3V To 5V
• Frequency Max: 32GHz
• Termination Type: SMD
• Package: 8SMD
• Typical Output Power: 8(Min)@29000MHz dBm
• Typical Power Gain: 23.6@29000MHz dB
• Typical Output Intercept Point: 18(Min)@29000MHz dBm
• Maximum Output Return Loss: 13(Min)@29000MHz dB
• Maximum Input Return Loss: 10(Min)@29000MHz dB
• Maximum Supply Voltage: 5 V
• Number Of Channels: 1
• Frequency (max): 32GHz
• Power Supply Requirement: Single
• Single Supply Voltage (min): 3V
• Single Supply Voltage (typ): 3V
• Single Supply Voltage (max): 5V
• Package Type: SMD
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Pin Count: 8
• Mounting: Surface Mount
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Frequency Min: 18GHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Manual Assembly
• Follow ESD precautions while handling packages.
• Handling should be along the edges with tweezers.
• Recommended attachment is conductive solder
• Apply solder paste using a stencil printer or dot place-
• Follow solder paste and vendor’s recommendations
• Packages have been qualified to withstand a peak
Figure 17. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
Package, Tape & Reel, and Ordering Information

paste. Please see recommended solder reflow profile.
Neither Conductive epoxy or hand soldering is recom-
mended.
ment. T he volume of solder paste will be dependent on
PCB and component layout and should be controlled
to ensure consistent mechanical and electrical perfor-
mance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tem-
perature to the pre-heat temp. to avoid damage due
to thermal shock.
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
300
250
200
150
100
50
0
0
Ramp 1
50
Preheat Ramp 2 Reflow
100
Peak = 250 ± 5˚C
Seconds
150
Melting point = 218˚C
200
Cooling
250
300
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 16. The stencil has a solder paste de-
position opening approximately 70% to 90% of the PCB
pad. Reducing stencil opening can potentially gener-
ate more voids underneath. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads. Considering
the fact that solder paste thickness will directly affect the
quality of the solder joint, a good choice is to use a laser
cut stencil composed of 0.127mm (5 mils) thick stainless
steel which is capable of producing the required fine
stencil outline.
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 17. This profile is
designed to ensure reliable finished joints. However,
the profile indicated in Figure 1 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
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