BGA2022,115 NXP Semiconductors, BGA2022,115 Datasheet
BGA2022,115
Specifications of BGA2022,115
934056238115
BGA2022 T/R
Related parts for BGA2022,115
BGA2022,115 Summary of contents
Page 1
DATA SHEET dbook, halfpage BGA2022 MMIC mixer Product specification Supersedes data of 2000 Jun 06 DISCRETE SEMICONDUCTORS MBD128 2000 Dec 04 ...
Page 2
... NXP Semiconductors MMIC mixer FEATURES Large frequency range: – Cellular band (900 MHz) – PCS band (1900 MHz) – WLAN band (2.4 GHz) High isolation High linearity High conversion gain. APPLICATIONS Receiver side of wireless systems that require high conversion gain and high linearity at low supply current, such as CDMA ...
Page 3
... NXP Semiconductors MMIC mixer LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER V supply voltage S I supply current S P oscillator power power RF P total power dissipation tot T storage temperature stg T junction temperature j Notes 1. LO and RF signals always AC coupled; 50 source; no external DC voltage supplied to pins 1, 2 and 6. ...
Page 4
... NXP Semiconductors MMIC mixer APPLICATION INFORMATION See application note number AN00059. RF input handbook, full pagewidth C2 L1 List of components (see Fig.2) COMPONENT C3 2000 Dec 04 C1 RF- signal RF- feedback 6 5 BGA2022 BIAS CONTROL GND LO - signal supply LO input Fig.2 Application diagram. APPLICATION BOARD 880 MHz ...
Page 5
... NXP Semiconductors MMIC mixer 400 handbook, halfpage R RF (Ω) 300 jX 200 R 100 0 0 1000 = 50 2 dBm Fig.3 RF input impedance as a function of frequency; typical values. 8 handbook, halfpage G C (dB −2 −4 −20 −15 − 2 dBm 1800 MHz C. T amb Fig.5 Conversion gain as a function of oscillator power ...
Page 6
... NXP Semiconductors MMIC mixer PACKAGE OUTLINE Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.20 0.8 0.10 OUTLINE VERSION IEC SOT363 2000 Dec scale 2.2 1.35 2.2 1.3 0.65 1.8 1.15 2 ...
Page 7
... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the ...
Page 8
... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
Page 9
... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...