TEF6721HL/V1,518 NXP Semiconductors, TEF6721HL/V1,518 Datasheet - Page 46

• Manufacturer Part Number: TEF6721HL/V1,518
• Description: IC DIGITAL IF FRONT END 64LQFP
• Manufacturer: NXP Semiconductors

Specifications of TEF6721HL/V1,518

• Modulation Or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 5V, 8.5V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Frequency: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Receiving: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935271928518; TEF6721HL/V1-T; TEF6721HL/V1-T

Philips Semiconductors
19. Revision history
Table 35:
TEF6721HL_4
Product data sheet
Document ID
TEF6721HL_4
Modifications:
TEF6721HL_3
TEF6721HL_2
TEF6721HL_1
Revision history
Release date
20051220
20050719
20040629
20031021
•
[4]
[5]
[6]
[7]
[8]
[9]
Table
shown in
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
29: Changed the ‘Crystal oscillator’ section; the driving of two tuners with one crystal is
Figure
Data sheet status
Product data sheet
Product data sheet
Product specification
Preliminary specification -
10.
Rev. 04 — 20 December 2005
Change notice
-
-
-
Car radio tuner front-end for digital IF
Doc. number
-
9397 750 15042
9397 750 13472
9397 750 11379
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
TEF6721HL
Supersedes
TEF6721HL_3
TEF6721HL_2
TEF6721HL_1
-
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