TEF6730HW/V1,518 NXP Semiconductors, TEF6730HW/V1,518 Datasheet

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TEF6730HW/V1,518

Manufacturer Part Number
TEF6730HW/V1,518
Description
IC DIGITAL IF FRONT END 64HTQFP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TEF6730HW/V1,518

Package / Case
64-TQFP Exposed Pad, 64-eTQFP, 64-HTQFP, 64-VQFP
Modulation Or Protocol
AM, FM, WB
Applications
AM/FM Radio Receiver
Current - Receiving
85.3mA, 114.7mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Voltage - Supply
8 V ~ 9 V
Operating Temperature
-40°C ~ 85°C
Bus Type
I2C
Maximum Agc
14 dB
Maximum Frequency
288 MHz, 108 MHz
Minimum Frequency
144 MHz, 65 MHz
Modulation Technique
AM, FM
Mounting Style
SMD/SMT
Function
Radio
Noise Figure
12.9 dB, 6.9 dB
Operating Supply Voltage
8.5 V
Supply Voltage (min)
8 V
Supply Voltage (max)
9 V
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 85 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Frequency
-
Sensitivity
-
Memory Size
-
Data Rate - Maximum
-
Lead Free Status / Rohs Status
Compliant
Other names
935278526518
TEF6730HW/V1-T
TEF6730HW/V1-T
1. General description
2. Features
The TEF6730 is a car radio tuner front-end for digital-IF reception, especially designed for
co-operation with digital-IF DSP back-ends of the SAF773x and SAF778x families.
The FM tuner features single conversion to IF = 10.7 MHz and integrated image rejection;
capable for FM 65 MHz to 108 MHz and weather band reception. The AM tuner features
single conversion to IF = 10.7 MHz with an integrated AM front-end, capable for LW, MW
and full SW reception. A combined AM/FM IF AGC amplifier provides a suitable IF signal
to the ADC in IF DSP.
The device can be controlled via the fast-mode I
autonomous tuning functions for easy control. No manual alignments are required.
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TEF6730
Front-end for digital-IF car radio
Rev. 01 — 10 July 2006
FM mixer for conversion of FM RF to IF 10.7 MHz with large dynamic range, high
image rejection and selectable mixer gain
Selectable high or low injection of LO
AGC PIN diode drive circuit for FM RF AGC with detection at RF and IF, including
keyed AGC function
RF input for weather band applications
Integrated AM front-end LNA
Integrated AM RF AGC for low desensitization and AGC PIN diode drive circuit with
detection at RF and IF
AM mixer for conversion of AM RF to IF 10.7 MHz
AM/FM IF AGC amplifier with large dynamic range, gain controlled from IF DSP
AM and FM front-end AGC information is available via the I
Low phase noise local oscillator with reliable start-up behavior
In-lock detection for optimized adaptive PLL tuning speed
Programmable divider and mixer dividers for reception of FM (65 MHz to 108 MHz),
weather band, AM LW, MW and full SW
Two antenna DAAs
Sequential state machine supporting all tuning actions including AFU for RDS
Interfacing signals for IF AGC, FM keyed AGC, AFU and reference frequency to
IF DSP for optimum system performance
Software controlled flag outputs
Selection of four I
2
C-bus addresses
2
C-bus (400 kHz) and includes
2
C-bus
Product data sheet

Related parts for TEF6730HW/V1,518

TEF6730HW/V1,518 Summary of contents

Page 1

TEF6730 Front-end for digital-IF car radio Rev. 01 — 10 July 2006 1. General description The TEF6730 is a car radio tuner front-end for digital-IF reception, especially designed for co-operation with digital-IF DSP back-ends of the SAF773x and SAF778x families. ...

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Philips Semiconductors 3. Quick reference data Table 1. Quick reference data see Figure CCA amb Symbol Parameter Supply voltage V analog supply voltage CCA Current in FM mode I total supply current ...

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Philips Semiconductors Table 1. Quick reference data see Figure CCA amb Symbol Parameter V RF input voltage i(RF) V peak RF input voltage i(RF)M IP2 second-order intercept point referenced to receiver input ...

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Philips Semiconductors [2] Conversion gain formula of DAA2: [3] The VCO frequency is determined by the external circuit at pins OSCFDB and OSCTNK. [4] Based on 15 pF/60 pF dummy aerial, voltages at dummy aerial input, f and nominal maximum ...

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OSCTNK pll vco vco 39 OSCFDB PLL N 36 CPOUT 35 VTUNE antenna DAA 33 DAAOUT2 32 DAAOUT1 29 WXMIXDEC 28 MIXER 90 WXMIXIN WX 27 FMMIXIN2 26 FMMIXIN1 ifagc 30 IFMAGC ...

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Philips Semiconductors 6. Pinning information 6.1 Pinning AMIFAGCIN FMIFAGCIN1 FMIFAGCIN2 FMMIXOUT1 AMMIXOUT2 FMMIXOUT2 AMMIXOUT1 AGCCNTRL Fig 2. Pin configuration for HTQFP64 6.2 Pin description Table 3. Symbol AMIFAGCIN FMIFAGCIN1 FMIFAGCIN2 IFAGCDEC SWDEC CFSW1 CFSW2 FMMIXOUT1 AMMIXOUT2 TEF6730_1 Product data sheet ...

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Philips Semiconductors Table 3. Symbol FMMIXOUT2 AMMIXOUT1 V CC(RF) V50LNA LNAIN AGCCNTRL i.c. LNAOUT i.c. LNAAGCDEC AMMIXDEC AMMIXIN TAMAGC PINAGCDEC IAMAGC RFGND FMMIXIN1 FMMIXIN2 WXMIXIN WXMIXDEC IFMAGC TFMAGC DAAOUT1 DAAOUT2 KAGC VTUNE CPOUT V CC(PLL) VCOGND OSCFDB OSCTNK V CC(VCO) ...

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Philips Semiconductors Table 3. Symbol SCL DGND FREF1 FREF2 VREF GND V CC IFOUT1 IFOUT2 IFAGCMSB IFAGCLSB V CC(IF) IFGND IFAGCBIAS 7. Functional description 7.1 FM mixer 1 The FM quadrature mixer converts FM RF (65 MHz to 108 MHz) ...

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Philips Semiconductors 7.4 AM LNA The AM low noise amplifier is fully integrated. 7 AGC The AM RF AGC is partially integrated. Detection is at the output of the AM LNA and at the input of the AM/FM ...

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Philips Semiconductors S SLAVE ADDRESS R Fig 4. Read mode 2 Table 4. Description of I C-bus format Code S Slave address W Slave address R ACK-s ACK-m NA MSA Data P 8.1 Read mode Read data is loaded into ...

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Philips Semiconductors Table 7. Bit 7 and 6 5 and 8.1.2 Read mode: data byte ID Table Table 9. Bit 8.2 Write mode The tuner is ...

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Philips Semiconductors The tuner circuit is controlled by the CONTROL register. Any data change in the CONTROL register has immediate effect and will change the operation of the tuner circuit accordingly. Transmitted I but loaded into a BUFFER register instead. ...

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Philips Semiconductors Table 10. Subaddress Fig 5. I TEF6730_1 Product data sheet Write mode subaddress overview Name CONTROL PLLM PLLL DAA AGC BAND TEST MODE MODE DECODER AFSAMPLE STATE MACHINE AFHOLD 2 C-bus ...

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Philips Semiconductors BUFFER CONTROL Fig 6. Write to CONTROL register with swap, REGC = 0 TEF6730_1 Product data sheet MODE = load, REGC = address MSA byte 2 byte 0 previous byte 1 previous byte 2 ...

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Philips Semiconductors BUFFER CONTROL Fig 7. Write to CONTROL register with swap, REGC = 1 TEF6730_1 Product data sheet MODE = load, REGC = address MSA byte 3 byte 0 previous current byte 1 previous current ...

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Philips Semiconductors 8.2.1 Mode and subaddress byte for write Table 11. 7 MODE2 Table 12. Bit Table 13. MODE2 MODE1 MODE0 Symbol [1] When the ...

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Philips Semiconductors register SWAP quality detectors WS processing Fig 8. Preset mode register SWAP Fig 9. Preset mode, started during mute TEF6730_1 Product data sheet 2 I C-bus P time 1 ms PLL tuning f1 f2 '10' TAS read '01' ...

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Philips Semiconductors register SWAP quality detectors WS processing Fig 10. Search mode register SWAP Fig 11. Search mode, started during mute TEF6730_1 Product data sheet 2 I C-bus P time 1 ms PLL tuning f1 f2 '10' TAS read '01' ...

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Philips Semiconductors register SWAP quality detectors WS processing Fig 12. AF update mode register SWAP Fig 13. AF update mode, started during mute TEF6730_1 Product data sheet 2 I C-bus P time 1 ms PLL tuning f1 f2 '10' TAS ...

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Philips Semiconductors register SWAP quality detectors WS processing Fig 14. Jump mode register SWAP Fig 15. Jump mode, started during mute TEF6730_1 Product data sheet 2 I C-bus P time 1 ms PLL tuning f1 f2 '10' TAS read '01' ...

Page 21

Philips Semiconductors register SWAP quality detectors WS processing Fig 16. Check mode register SWAP Fig 17. Check mode, started during mute TEF6730_1 Product data sheet 2 I C-bus P time 1 ms PLL tuning f1 f2 '10' TAS read '01' ...

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Philips Semiconductors quality detectors WS processing Fig 18. End mode 8.2.2 Write mode: data byte CONTROL Table 14. 7 RFGAIN 0 Table 15. Bit and 2 TEF6730_1 Product data sheet 2 I C-bus P time ...

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Philips Semiconductors Table 15. Bit 1 0 8.2.3 Write mode: data byte PLLM Table 16. 7 CPOFF 0 Table 17. Bit 8.2.4 Write mode: data byte PLLL Table 18. 7 PLL7 0 Table 19. Bit 7 ...

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Philips Semiconductors Table 21. Bit 8.2.6 Write mode: data byte AGC Table 22. 7 SDAA3 1 Table 23. Bit and Table 24. WBAGC1 Table 25. ...

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Philips Semiconductors 8.2.7 Write mode: data byte BAND Table 26. 7 BAND2 0 Table 27. Bit Table 28. BAND2 Table 29. FREF2 0 0 ...

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Philips Semiconductors Table 30. Charge pump source FREF2 FREF1 [ don’t care. 8.2.7.1 Tuning overview If LOINJ = 0: If LOINJ = 1: tuning step FM ...

Page 27

Philips Semiconductors 9. Limiting values Table 33. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V analog supply voltage CCA V voltage difference between CCAn any analog supply pins V voltage on pin SCL ...

Page 28

Philips Semiconductors 11. Static characteristics Table 35. Static characteristics unless otherwise specified. CCA amb Symbol Parameter Supply voltage V analog supply voltage on pins V CCA Current in FM mode I RF ...

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Philips Semiconductors Table 35. Static characteristics unless otherwise specified. CCA amb Symbol Parameter I supply current AGC supply current T CC(IFAGC) I current on AMMIXOUT1 pin AMMIXOUT1 I current ...

Page 30

Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter f frequency deviation Charge pump: pin CPOUT; see Table 30 I CP1 sink current sink(CP1) I CP1 source current source(CP1) ...

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Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter V output voltage o V output noise voltage n(o) V output voltage o(T) deviation over temperature V step output voltage ...

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Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter V output voltage o(T) deviation over temperature V step output voltage o(step) tolerance V output voltage o deviation t output ...

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Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter C input capacitance i G transconductance gain transconductance gain m(T) deviation over temperature IP3 third-order intercept point ...

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Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter G conversion m(conv)(T) transconductance gain deviation over temperature IP3 third-order intercept point IP2 second-order intercept point V equivalent input noise ...

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Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter FM RF AGC narrow-band detector: pins IFOUT1 and IFOUT2 V peak output voltage o(IFOUT)(M) between pin IFOUT1 and pin IFOUT2 ...

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Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter C input capacitance i G conversion m(conv) transconductance gain G conversion m(conv)(T) transconductance gain deviation over temperature NF noise figure ...

Page 37

Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter G gain NF noise figure IM3 third-order intermodulation distance TEF6730_1 Product data sheet …continued 25; all AC values are given ...

Page 38

Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter V peak maximum input i(max)(M) voltage FM mode; inputs: pins FMIFAGCIN1 and IFAGCDEC R input resistance i C input capacitance ...

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Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter V peak maximum input i(max)(M) voltage FM mode; inputs: pins FMIFAGCIN2 and IFAGCDEC R input resistance i C input capacitance ...

Page 40

Philips Semiconductors Table 36. Dynamic characteristics see Figure CCA amb Symbol Parameter V peak maximum input i(max)(M) voltage Digital inputs and outputs Input: pins IFAGCMSB and IFAGCLSB V LOW-level input IL voltage ...

Page 41

Philips Semiconductors 2 G m(T) (dB Fig 19. AM LNA transconductance gain deviation over temperature (including application) 0.5 G m(conv)(T) (dB) 0 0.5 1.0 1 Fig 21. FM mixer conversion ...

Page 42

Philips Semiconductors 2 Table 37. I C-bus parameters Symbol Parameter V LOW-level input IL voltage V HIGH-level input IH voltage C capacitance for each i I/O pin t HIGH-to-LOW data resp(Q)HL output response time t LOW-to-HIGH data resp(Q)LH output response ...

Page 43

Philips Semiconductors Fig 24. Definition of the fall time of the output signal 14. Overall system parameters Table 38. Overall system parameters see Figure CCA amb Symbol Parameter [1] AM overall system ...

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Philips Semiconductors Table 38. Overall system parameters see Figure CCA amb Symbol Parameter V sensitivity voltage sens V RF input voltage i(RF) V peak RF input voltage i(RF)M IP3 third-order intercept point ...

Page 45

BB208 50 nH 270 pF 39 4 3.9 1 antenna DAA 33 100 6.8 pF ...

Page 46

Philips Semiconductors Fig 26. Weather band application Table 39. Symbol Component Fig 27. FM and AM mode TEF6730_1 Product data sheet input L7 ...

Page 47

Philips Semiconductors Fig 28. FM/AM and FM HD mode Fig 29. FM and AM (narrow band) mode TEF6730_1 Product data sheet TEF6730HW TEF6730HW ...

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Philips Semiconductors Fig 30. FM, AM and FM HD mode TEF6730_1 Product data sheet TEF6730HW Rev. 01 — 10 July 2006 TEF6730 Front-end for digital-IF car radio ...

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Philips Semiconductors 16. Package outline HTQFP64: plastic thermal enhanced thin quad flat package; 64 leads; body mm; exposed die pad y exposed die pad pin 1 index ...

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Philips Semiconductors 17. Soldering 17.1 Introduction to soldering surface mount packages There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not ...

Page 51

Philips Semiconductors – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to ...

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Philips Semiconductors [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C body ...

Page 53

Philips Semiconductors 18. Footprint for soldering Dimensions in mm Fig 32. Footprint TEF6730_1 Product data sheet 4.700 (2 ) 4.800 (2 ) 0.400 (3 ) solder land solder paste deposit solder land plus solder paste placement area occupied area Rev. ...

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Philips Semiconductors 19. Abbreviations Table 43. Abbreviations Acronym Description ADC Analog-to-Digital Converter AF Alternative Frequency AFU Alternative Frequency Updating AGC Automatic Gain Control DAA Digital Auto Alignment DSP Digital Signal Processor DX Distance HD High Definition IF Intermediate Frequency LNA ...

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Philips Semiconductors 21. Legal information 21.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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Philips Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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