AT86RF231-ZUR Atmel, AT86RF231-ZUR Datasheet - Page 116

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AT86RF231-ZUR

Manufacturer Part Number
AT86RF231-ZUR
Description
IC RADIO TXRX 2.4GHZ 32-VQFN
Manufacturer
Atmel
Datasheet

Specifications of AT86RF231-ZUR

Frequency
2.4GHz
Data Rate - Maximum
2Mbps
Modulation Or Protocol
802.15.4 Zigbee, 6LoWPAN, RF4CE, SP100, WirelessHART™, ISM
Applications
Industrial Monitoring and Control, Wireless Alarm and Security Systems
Power - Output
-17dBm ~ 3dBm
Sensitivity
-101dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
12.3mA
Current - Transmitting
14mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Operating Temperature
-40°C ~ 85°C
Package / Case
32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
2405 MHz to 2480 MHz
Interface Type
SPI
Noise Figure
6 dB
Output Power
20 dB
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Supply Current
12.3 mA
Minimum Operating Temperature
- 40 C
Modulation
OQPSK
Protocol Supported
802.15.4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
9.6
9.6.1
9.6.2
8111C–MCU Wireless–09/09
Crystal Oscillator (XOSC)
Overview
Integrated Oscillator Setup
The main crystal oscillator features are:
The crystal oscillator generates the reference frequency for the AT86RF231. All other internally
generated frequencies of the radio transceiver are derived from this unique frequency. There-
fore, the overall system performance is mainly determined by the accuracy of crystal reference
frequency. The external components of the crystal oscillator should be selected carefully and the
related board layout should be done with caution (see
12).
The register 0x12 (XOSC_CTRL) provides access to the control signals of the oscillator. Two
operating modes are supported. It is recommended to use the integrated oscillator setup as
described in
nal circuitry by using an external clock reference as shown in
Using the internal oscillator, the oscillation frequency depends on the load capacitance between
the crystal pins XTAL1 and XTAL2. The total load capacitance C
load capacitance of the crystal itself. It consists of the external capacitors CX and parasitic
capacitances connected to the XTAL nodes.
Figure 9-7 on page 116
the pin input capacitance, summarized to C
Figure 9-7.
Additional internal trimming capacitors C
4.5 pF with a 0.3 pF resolution is selectable using XTAL_TRIM of register 0x12 (XOSC_CTRL).
• 16 MHz amplitude controlled crystal oscillator
• 330 µs typical settling time after leaving SLEEP state
• Configurable trimming capacitance array
• Configurable clock output (CLKM)
Figure 9-7 on page
Simplified XOSC Schematic with External Components
EVDD
XTAL_TRIM[3:0]
shows all parasitic capacitances, such as PCB stray capacitances and
V
DD
C
TRIM
116; nevertheless a reference frequency can be fed to the inter-
XTAL1
C
PAR
TRIM
PAR
CX
EVDD
are available. Any value in the range from 0 pF to
.
16MHz
Section 5. “Application Circuits” on page
XTAL2
CX
XTAL_TRIM[3:0]
Figure 9-8 on page
L
AT86RF231
must be equal to the specified
C
TRIM
C
PAR
PCB
AT86RF231
117.
116

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