BF1108,215 NXP Semiconductors, BF1108,215 Datasheet
BF1108,215
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BF1108,215 Summary of contents
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BF1108; BF1108R Silicon RF switches Rev. 04 — 29 May 2008 1. Product profile 1.1 General description These switches are a combination of a depletion type Field-Effect Transistor (FET) and a band-switching diode in an SOT143B (BF1108) or SOT143R (BF1108R) ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin BF1108 (SOT143B BF1108R (SOT143R [1] Drain and source are interchangeable. 3. Ordering information Table 3. Type number BF1108 BF1108R 4. Marking Table 4. Type number BF1108 BF1108R BF1108_BF1108R_4 Product data sheet Pinning Description FET gate; diode anode diode cathode source drain FET gate ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol FET Diode FET and diode T stg Thermal characteristics Table 6. Symbol R th(j-sp) [1] Soldering point of FET gate and diode anode lead. 7. Static characteristics Table unless otherwise specified. ...
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... NXP Semiconductors 8. Dynamic characteristics Table 8. Common cathode; T Symbol Parameter FET and diode L ins(on) ISL off R DSon Diode [ diode forward current the series connection [3] Guaranteed on AQL basis; inspection level S4, AQL 1.0. BF1108_BF1108R_4 Product data sheet Dynamic characteristics = 25 C. amb Conditions on-state insertion loss ...
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... NXP Semiconductors 0 L ins(on 400 forward current). Measured in test circuit see Fig 1. On-state insertion loss as a function of frequency; typical values On-state Off-state Fig 3. Test circuit BF1108_BF1108R_4 Product data sheet mgs357 ISL off 800 1200 f (MHz (diode F Figure 3. Fig 2. Off-state isolation as a function of frequency; ...
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... NXP Semiconductors 9. Package outline Plastic surface-mounted package; 4 leads DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.48 0.88 0.1 mm 0.9 0.38 0.78 OUTLINE VERSION IEC SOT143B Fig 4. Package outline SOT143B BF1108_BF1108R_4 Product data sheet scale 0.15 3.0 1.4 1.9 1.7 0.09 2 ...
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... NXP Semiconductors Plastic surface-mounted package; reverse pinning; 4 leads DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.48 0.88 0.1 mm 0.9 0.38 0.78 OUTLINE VERSION IEC SOT143R Fig 5. Package outline SOT143R BF1108_BF1108R_4 Product data sheet scale 0.15 3.0 1.4 1.9 1.7 0.09 2 ...
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... Data sheet status Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Symbol notation has been adapted to comply with the current guidelines of NXP Semiconductors ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 4 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Legal information ...