MCF51MM256CMB Freescale Semiconductor, MCF51MM256CMB Datasheet - Page 17

• Manufacturer Part Number: MCF51MM256CMB
• Description: IC MCU 32BIT 256K FLASH 81MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF51MMr

Specifications of MCF51MM256CMB

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 48
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x16b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 81-LBGA
• Processor Series: MCF51MM
• Core: ColdFire V1
• Data Bus Width: 32 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: TWR-MCF51MM-KIT, TWR-SER, TWR-ELEV, TOWER
• Package: 81MAPBGA
• Device Core: ColdFire
• Family Name: MCF51MM
• Maximum Speed: 50.33 MHz
• Operating Supply Voltage: 2.5|3.3 V
• Number Of Programmable I/os: 48
• Interface Type: I2C/SCI/SPI
• On-chip Adc: 8-chx16-bit
• On-chip Dac: 1-chx12-bit
• Number Of Timers: 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

3.3
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
P
V
loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
Freescale Semiconductor
I/O
DD
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
into account in power calculations, determine the difference between actual pin voltage and V
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
1
2
3
4
T

P
P
P
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Junction to Ambient Natural Convection
1s — Single layer board, one signal layer
2s2p — Four layer board, 2 signal and 2 power layers
JA
A
D
int
I/O
Thermal Characteristics
#
1
2
3
4
= Ambient temperature, C
= P
= Package thermal resistance, junction-to-ambient, C/W
= I
= Power dissipation on input and output pins — user determined
int
DD
P
 V
I/O
Symbol
DD
T
JMAX


T
, Watts — chip internal power
JA
JA
A
Operating temperature range (packaged):
Maximum junction temperature
Thermal resistance
Thermal resistance
Table 6. Thermal Characteristics
T
J
J
) in C can be obtained from:
= T
A
1,2,3,4
1, 2, 3, 4
+ (P
SS
Rating
MCF51MM256
MCF51MM128
104-pin MBGA
100-pin LQFP
81-pin MBGA
80-pin LQFP
104-pin MBGA
100-pin LQFP
81-pin MBGA
80-pin LQFP
or V
D
Single-layer board — 1s
Four-layer board — 2s2p
 
DD
JA
)
will be very small.
–40 to 105
–40 to 105
Value
135
67
53
67
53
39
41
39
39
Electrical Characteristics
C/W
C/W
Unit
C
C
SS
Eqn. 1
or
17