MCF51MM256CMB Freescale Semiconductor, MCF51MM256CMB Datasheet - Page 56

• Manufacturer Part Number: MCF51MM256CMB
• Description: IC MCU 32BIT 256K FLASH 81MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF51MMr

Specifications of MCF51MM256CMB

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 48
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x16b, D/A 1x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 81-LBGA
• Processor Series: MCF51MM
• Core: ColdFire V1
• Data Bus Width: 32 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: TWR-MCF51MM-KIT, TWR-SER, TWR-ELEV, TOWER
• Package: 81MAPBGA
• Device Core: ColdFire
• Family Name: MCF51MM
• Maximum Speed: 50.33 MHz
• Operating Supply Voltage: 2.5|3.3 V
• Number Of Programmable I/os: 48
• Interface Type: I2C/SCI/SPI
• On-chip Adc: 8-chx16-bit
• On-chip Dac: 1-chx12-bit
• Number Of Timers: 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Revision History
4.3
Table 31
outline/mechanical drawings are available on the MCF51MM256/128 Product Summary pages at
http://www.freescale.com.
To view the latest drawing, either:
5
This section lists major changes between versions of the MCF51MM256 Data Sheet.
56
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
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Revision
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document number (from
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Mechanical Drawings
Revision History
March/April 2009 Initial Draft
October 2010
April 2010
July 2009
July 2009
Date
• Revised to follow standard template.
• Removed extraneous headings from the TOC.
• Corrected units for Monotoncity to be blank in for the DAC specification.
• Updated ADC characteristic tables to include 16-Bit SAR in headings.
• Changed MCG (XOSC) Electricals Table - Row 2, Average Internal Reference
• Updated Thermal Characteristics table. Reinserted the 81 and 104 MapBGA devices.
• Revised the ESD and Latch-Up Protection Characeristic description to read: Latch-up
• Changed Table . DC Characteristics rows 2 and 4, to 1.8 V, ILoad = -600 mA
• Corrected the 16-bit SAR ADC Operating Condition table Ref Voltage High Min value
• Updated the ADC electricals.
• Inserted the Mini-FlexBus Timing Specifications.
• Added a Temp Drift parameter to the VREF Electrical Specifications.
• Removed the S08 Naming Convention diagram.
• Updated the Orderable Part Number Summary to include the Freescale Part Number
• Completed the Package Description table values.
• Changed the 80LQFP package drawing from 98ARL10530D to 98ASS23174W.
• Updated with the latest characteristic data. Added several figures. Added the ADC
Table
Frequency typical value from 32.768 to 31.25.
Current at T
conditions to 1.8 V, ILoad = 600A respectively.
to be 1.13 instead of 1.15.
suffixes.
Updated electrical characteristic data.
Typical Operation table.
31) in the “Enter Keyword” search box at the top of the page.
Table 31,
®
Table 32. Revision History
website (http://www.freescale.com), and enter the appropriate
A
= 125°C.
or
Description
Freescale Semiconductor